Pressure sensor chip packaging system and packaging method thereof
A pressure sensor and chip packaging technology, applied in the direction of measuring fluid pressure, instruments, measuring force, etc., can solve the problems affecting the quality of chip molding, affecting the efficiency of packaging, etc., and achieve the effect of improving packaging efficiency and improving molding efficiency.
Active Publication Date: 2022-01-18
山东晶芯科创半导体有限公司
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Problems solved by technology
[0002] When packaging the chip, it is necessary to apply glue between the chip and the shell and then heat seal it. When the chip and the shell are assembled and heat-sealed in the vertical direction, it is necessary to apply glue on the surface of the chip before placing the shell to complete the thermal packaging. In the existing technology, the station where the shell is placed is far away from the station where the chip is placed. After the surface of the chip is coated with glue, if the shell is not placed in time, it will not only affect the efficiency of packaging, but also affect the quality of chip molding.
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[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.
[0031] In describing the embodiments o...
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The invention discloses a pressure sensor chip packaging system and a packaging method thereof. It includes a base, and support plates are fixedly connected to both sides of the top of the base, and a first connecting plate is rotatably installed between the two support plates along one end of the length direction thereof. One end is rotatably installed with a second connecting plate, the bottom of the first transmission block is rotatably connected with the first transmission block, the top of the second connecting plate is rotatably installed with the second transmission block, and the side of the first transmission block facing away from the second transmission block is formed There is a groove, and the inside of the groove is rotatably connected with a housing tube for accommodating chips, and the side of the second transmission block away from the first transmission block is formed with a housing groove for accommodating the packaging shell, and the back of the second transmission block is fixed A fixed plate is installed, and an air cylinder is fixedly installed on the inner side of the fixed plate. The station layout of the present invention is reasonable, and the chip and the packaging shell are thermally packaged along the vertical direction. After the glue is applied, the package shell and the chip can be quickly approached to improve the molding efficiency and realize the improvement of the packaging efficiency.
Description
technical field [0001] The invention belongs to the technical field of chip packaging, and in particular relates to a pressure sensor chip packaging system and a packaging method thereof. Background technique [0002] When packaging the chip, it is necessary to apply glue between the chip and the shell and then heat seal it. When the chip and the shell are assembled and heat-sealed in the vertical direction, it is necessary to apply glue on the surface of the chip before placing the shell to complete the thermal packaging. In the prior art, the station where the case is placed is far away from the station where the chip is placed. After the surface of the chip is coated with glue, if the case is not placed in time, it will not only affect the efficiency of packaging, but also affect the quality of chip molding. Contents of the invention [0003] The object of the present invention is to provide a pressure sensor chip packaging system and a packaging method thereof, so as t...
Claims
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IPC IPC(8): G01L1/00G01L11/00B05C5/02B05C13/02
CPCG01L1/00G01L11/00B05C5/0208B05C13/02
Inventor 徐辉张航张孝忠郭剑汤富强黎梓兰刘仁飞
Owner 山东晶芯科创半导体有限公司