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Heat dissipation back splint and electronic equipment assembly

A heat dissipation component and technology of electronic equipment, applied in the electronic field, can solve the problems of poor heat dissipation effect of the heat dissipation back clip, achieve the effect of improving user experience and improving heat transfer efficiency

Pending Publication Date: 2021-11-19
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of this application is to provide a heat dissipation back clip and an electronic device component, which can solve the problem of poor heat dissipation effect of the existing heat dissipation back clip

Method used

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  • Heat dissipation back splint and electronic equipment assembly
  • Heat dissipation back splint and electronic equipment assembly
  • Heat dissipation back splint and electronic equipment assembly

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Embodiment Construction

[0035] Embodiments of the present application will be described in detail below, examples of which are shown in the drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, and are only for explaining the present application, and should not be construed as limiting the present application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0036] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "one side", "the other side" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present a...

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Abstract

The invention discloses a heat dissipation back clamp and an electronic equipment assembly. The heat dissipation back clamp comprises a shell, a substrate, a heat dissipation assembly, and a refrigeration part. A containing cavity with an opening is formed in the shell, the heat dissipation assembly is arranged in the containing cavity, and the substrate covers the opening; the refrigeration part is provided with a heat absorption end and a heat release end, the heat absorption end of the refrigeration part is arranged on one side of the substrate, and the heat release end of the refrigeration part is arranged between the other side of the substrate and the heat dissipation assembly; and / or, the heat release end of the refrigeration part is arranged on the shell.

Description

technical field [0001] The application belongs to the field of electronic technology, and in particular relates to a heat dissipation back clip and electronic equipment components. Background technique [0002] With the rapid development of electronic devices, the functions of electronic devices have not only provided basic functions such as calling and sending text messages, but the current electronic devices also take into account other functions such as games, photos, and videos. As the configuration of electronic equipment becomes higher and higher, and the performance becomes stronger and stronger, various electronic components generate more and more heat during work, and the impact on electronic equipment will become more and more serious. Therefore, the heat dissipation of electronic equipment becomes become more and more important. [0003] In order to better dissipate heat from the electronic device, a heat dissipation back clip is usually installed on the electron...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K5/02
CPCH05K7/20H05K7/2039H05K7/20136H05K5/0217
Inventor 方文兵郭阳
Owner VIVO MOBILE COMM CO LTD