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Method for monitoring pin reliability of pin packaging in situ in real time by using four-probe method

A four-probe method, real-time monitoring technology, used in semiconductor/solid-state device testing/measurement, electrical components, circuits, etc., can solve problems such as inapplicable identification, and achieve the effect of improving accuracy, small size, and accurate measurement

Pending Publication Date: 2021-11-23
FUDAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these methods are not suitable for the identification of in-situ crack generation

Method used

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  • Method for monitoring pin reliability of pin packaging in situ in real time by using four-probe method
  • Method for monitoring pin reliability of pin packaging in situ in real time by using four-probe method
  • Method for monitoring pin reliability of pin packaging in situ in real time by using four-probe method

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Experimental program
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Embodiment Construction

[0020] The invention measures resistance based on a four-probe method, and performs reliability performance and accelerated testing of pin packaging through a four-probe real-time monitoring method for volume resistivity.

[0021] The measurement principle of the inventive method is as figure 2 ; When the four metal probes of probes 1, 2, 3, and 4 are arranged in a straight line and pressed against the semiconductor material with a certain pressure, and a current I passes between the two probes of probes 1 and 4, the probes A potential difference V is generated between 2 and 3.

[0022] Material resistivity:

[0023] (1)

[0024] probe coefficient

[0025] (2)

[0026] In the formula: S1, S2, and S3 are the distances between probes 1 and 2, 2 and 3, and 3 and 4 respectively, and each probe has its own coefficient.

[0027] Since the bulk and bar-shaped samples conform to the semi-infinite boundary condition compared with the distance between the probes, the resisti...

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Abstract

The invention discloses a method for monitoring pin reliability of pin packaging in situ in real time by using a four-probe method. According to the method, the resistance of the pins in the packaging structure is monitored and measured by using a four-probe method, viscoplastic deformation before cracks are generated and expansion of the cracks in the pins are detected based on resistance change, and accurate in-situ crack identification is realized. According to the invention, based on the characteristic of micro-resistance change caused by crack generation in the pin, the problems of crack generation and failure of the pin are rapidly and accurately judged by accurately measuring the resistance change of the pin, in-situ monitoring is carried out on the pin reliability, and compared with other measurement methods in the prior art, the method is simpler and more efficient; crack judgment can be performed in a reliability test of a device, and an experiment is terminated in advance, so that time and cost are saved; according to the invention, a plurality of probe pin contact schemes are adopted, good contact between the probe and a tested point is realized, and the test accuracy can be further improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and specifically relates to a method for in-situ and real-time monitoring of pin reliability of pin packaging by using a four-probe method. Background technique [0002] With the light and intelligent development of industrial products, the market demand for chips has increased, the global packaging and testing market has maintained steady growth, the domestic packaging and testing market has continued to grow, and the demand for reliability testing has grown rapidly. In the field of electronic packaging and testing, solder joints are generally regarded as the weakest part of the packaging system, and have the highest probability of failure in applications. Therefore, the reliability of solder interconnection is an important factor in evaluating the quality of packaging. Device aging accelerated testing is a widely used reliability evaluation scheme. This scheme has been developed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66
CPCH01L22/14H01L22/26
Inventor 刘盼唐久阳张靖
Owner FUDAN UNIV
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