The invention discloses a method for monitoring pin reliability of pin packaging in situ in real time by using a four-probe method. According to the method, the resistance of the pins in the packaging structure is monitored and measured by using a four-probe method, viscoplastic deformation before cracks are generated and expansion of the cracks in the pins are detected based on resistance change, and accurate in-situ crack identification is realized. According to the invention, based on the characteristic of micro-resistance change caused by crack generation in the pin, the problems of crack generation and failure of the pin are rapidly and accurately judged by accurately measuring the resistance change of the pin, in-situ monitoring is carried out on the pin reliability, and compared with other measurement methods in the prior art, the method is simpler and more efficient; crack judgment can be performed in a reliability test of a device, and an experiment is terminated in advance, so that time and cost are saved; according to the invention, a plurality of probe pin contact schemes are adopted, good contact between the probe and a tested point is realized, and the test accuracy can be further improved.