System for testing viscoplastic material creep by utilizing heat-electricity-force coupling field

Abstract

The invention provides a system for testing viscoplastic material creep by utilizing a heat-electricity-force coupling field. The system comprises a drawing machine, an upper dowel bar piece and a lower dowel bar piece, wherein a high-low temperature environment test chamber is arranged between the upper dowel bar piece and the lower dowel bar piece; an insulated clamping end is arranged at each of the tail ends of the upper dowel bar piece and the lower dowel bar piece in a chamber body, and the insulated clamping ends are arranged oppositely and used for clamping a test piece; a conducting ring is connected with a current source by a current lead; a force sensor is arranged near the insulated clamping end on the upper dowel bar piece. Compared with relative technologies, a heat field, anelectric field and a force field are simultaneously exerted on the test piece by the creep test system of the viscoplastic material by utilizing the heat-electricity-force coupling field, so that thecreep property of an electronic packaging material in a real extreme working condition can be observed.

Description

technical field [0001] The invention belongs to the mechanical performance testing technology of electronic packaging materials, and relates to the thermal-electrical-force multi-field coupling testing technology of lead-free solder which will be widely used in electronic packaging materials under the temperature condition of -50°C to 300°C. Testing technique for creep behavior of viscoplastic lead-free solder under force-coupled conditions. Background technique [0002] Electronic packaging technology plays a vital role in electronic products. The interconnection solder joints in the electronic packaging structure are the key parts of the microelectronic chip. They not only provide mechanical support for the chip and the substrate, but also are an important way for electrical connection and heat dissipation. High-performance electronic products generally contain tens of thousands of solder joints, and the failure of a single solder joint at a critical position may lead to ...

AI Technical Summary

Problems solved by technology

However, most of the existing test methods are limited to the two-field coupling effect of thermal-mechanical or electric-force, and a multi-field coupling test system has not been realized, so there is a lack of a way to test and observe the creep of viscoplastic materials under the thermal-electrical-force coupling effect. behavioral testing system

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