Thick film chip winding and planar chip

Abstract

The invention discloses a thick film chip winding and a planar chip. The thick film chip winding comprises more than two single-piece winding units and a plurality of pin headers; each single-piece winding unit comprises an insulating base material and a winding layer, wherein the winding layer is connected to the surface of the insulating base material, and the winding layer comprises at least one winding coil segment; the winding coil segments of more than two single-piece winding units are connected to form at least one winding coil; the side edges of the insulating base materials are fixed by the pin headers, the pin headers connect the more than two single-piece winding units in a series connection mode, a space is reserved between every two adjacent insulating base materials, and the space is determined by the pin headers; and the pin headers are mutually insulated or are conducted through at least one winding coil segment. According to the thick film chip winding provided by the invention, the distance between the two insulating base materials is determined by customizing the pin headers, so that it can be ensured that the distance between the two insulating base materials is equal.

Description

technical field [0001] The invention relates to the technical field of circuit chips, in particular to a thick-film chip winding and a planar chip. Background technique [0002] In the field of chip transformers, commonly used substrates are mainly flexible circuit boards, printed circuit boards, ceramic copper clad laminates, low-temperature co-fired ceramic boards, high-temperature co-fired ceramic boards, etc. Due to the limitation of the process, it is impossible to make a substrate with very thick copper foil for firing ceramic boards. Generally, the copper thickness does not exceed 0.1mm. As the power of the chip transformer gradually increases, and in order to ensure that the volume of the transformer is reduced as much as possible, thicker copper foil is required to make the winding of the chip transformer. At this time, it is more suitable to use printed circuit boards and ceramic copper-clad laminates, but ceramic Copper-clad laminates cannot be multi-layered, so ...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the defects of the prior art, the object of the present invention is to provide a thick-film chip winding and a planar chip, through-holes are processed on each single-chip winding unit, and the single-chip winding units are connected in series and fixed through row pins, thereby maintaining There is a fixed gap between the monolithic winding units, which solves the problem that the thick film chip winding with high power needs thicker adhesive material connection, which leads to further increase of the overall thickness, and the uneven distance between the monolithic winding units

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