Ultra-thin VC copper sheet heat dissipation plate for 5G mobile phone

Abstract

The invention discloses an ultra-thin VC copper sheet heat dissipation plate for a 5G mobile phone, and belongs to the technical field of heat dissipation plates, the ultra-thin VC copper sheet heat dissipation plate comprises an upper cover and a lower cover covering the surface of the upper cover, a filling cavity is formed between the upper cover and the lower cover, the filling cavity is filled with cooling liquid, and capillary structures are arranged in the upper cover and the lower cover. A wavy supporting structure is arranged in the filling cavity, and through holes are formed in the side faces of the upper portion and the lower portion of the supporting structure. According to the ultra-thin VC copper sheet heat dissipation plate for the 5G mobile phone, the supporting structure is arranged to be the integrated wavy copper sheet, the overall heat dissipation effect of the heat dissipation plate is guaranteed, meanwhile, the supporting structure is convenient to install, the heat dissipation plate is convenient to machine, and the machining time is saved. Through holes are formed in the side faces of the upper portion and the lower portion of the supporting structure to guarantee that the filling cavity can be rapidly filled with cooling liquid, and the supporting structure cannot hinder flowing of the cooling liquid.

Description

technical field [0001] The invention relates to the technical field of heat dissipation plates, in particular to an ultra-thin VC copper heat dissipation plate for 5G mobile phones. Background technique [0002] The VC copper sheet cooling plate is usually a vacuum cavity soaking plate. Early mobile phone heat dissipation generally used graphite as the main material, which can be called the first generation of heat dissipation. Then copper tube liquid cooling is the second generation heat dissipation technology, and VC vapor chamber is the latest third generation heat dissipation technology. VC liquid cooling can be regarded as the dimension-enhancing technology of copper tube liquid cooling. Although both are based on the principle of gas-liquid phase transition, the difference is that the heat pipe only has a "linear" effective heat conduction capacity in a single direction, while VC is equivalent to "linear" heat conduction from "line" "to the surface" dimension enhance...

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Problems solved by technology

[0005] The main purpose of the present invention is to propose an ultra-thin VC copper cooling plate for 5G mobile phones, aiming to solve the technical problems that the support structure of the existing cooling plate uses copper pillars, which is inconvenient to install and complicated in processing procedures

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