Phosphorus-free nitrogen-free semiconductor packaging cleaning agent
A semiconductor and cleaning agent technology, applied in the field of cleaning agents, can solve problems such as human fertility hazards and environmental pollution, achieve optimal cleaning effects, avoid environmental pollution, and be environmentally friendly cleaning efficiency
Pending Publication Date: 2021-11-30
东莞优诺电子焊接材料有限公司
View PDF8 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] For semiconductor packaging cleaning agents in the prior art, tetrahydrofurfuryl alcohol or ether alcohol solvents are often selected as the main cleaning material, among which tetrahydrofurfuryl alcohol will cause harm to human fertility; auxiliary materials such as amines and octanol phosphates are used to improve cleaning power, while phosphorus and nitrogen additives will pollute the environment
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0025] The phosphorus-free and nitrogen-free semiconductor encapsulation cleaning agent of the present embodiment comprises the raw material of following weight percent:
[0026]
Embodiment 2
[0028] The phosphorus-free and nitrogen-free semiconductor encapsulation cleaning agent of the present embodiment comprises the raw material of following weight percent:
[0029]
Embodiment 3
[0031] The phosphorus-free and nitrogen-free semiconductor encapsulation cleaning agent of the present embodiment comprises the raw material of following weight percent:
[0032]
[0033] The preparation method of the non-phosphorous and nitrogen-free semiconductor packaging cleaning agent of Examples 1-3 is to weigh each component according to the formula amount and mix them evenly.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to the technical field of cleaning agents, in particular to a phosphorus-free and nitrogen-free semiconductor packaging cleaning agent which comprises 1-phenoxy-2-propanol, an inorganic saponifying agent, a bubble-free emulsifier, a pH regulator and deionized water, the mass ratio of the inorganic saponifying agent to the pH regulator is (3-7):(4.5-10.5), the mass ratio of the 1-phenoxy-2-propanol to the inorganic saponifying agent to the bubble-free emulsifier is (20-65):(3-7):(20-35), and the conductivity of the deionized water is less than 5 [mu]s. The 1-phenoxy-2-propanol, the inorganic saponifying agent, the bubble-free emulsifier and the pH regulator have a synergistic effect, so that the semiconductor packaging cleaning agent has the advantages of environment friendliness and high cleaning efficiency.
Description
technical field [0001] The invention relates to the technical field of cleaning agents, in particular to a phosphorus- and nitrogen-free semiconductor package cleaning agent. Background technique [0002] As the foundation and support for the development of the modern electronics industry, semiconductors are more and more widely used and selected materials in the electronics industry. However, with the continuous improvement of the integration, high precision and high reliability requirements of semiconductor products, the attention and reliability of the semiconductor package cleaning industry are also getting higher and higher. Flux and solder paste are usually used as soldering auxiliary materials in the semiconductor device packaging process, and these auxiliary materials will have some residues during the soldering process. Residues and pollutants have complex components, and there is a risk of corrosion to devices under the action of air oxidation and moisture, especi...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): C11D1/72C11D3/60C11D3/04C11D3/20C11D3/43C11D11/00H01L21/02
CPCC11D1/72C11D3/0047C11D3/044C11D3/2086C11D3/2068C11D3/43H01L21/02057C11D2111/22
Inventor 白映月屈东方
Owner 东莞优诺电子焊接材料有限公司