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Electronic module for chip card comprising a display screen

A technology of electronic modules and chip cards, applied to record carriers used in machines, instruments, computer components, etc.

Pending Publication Date: 2021-11-30
SMART PACKAGING SOLUTIONS SPS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] These different problems are not specific to the well-known ISO 7816-1 specification chip cards, but they apply in the same way to cards with similar components and functions but presenting different form factors (such as e.g. electronic ID cards or passports) or the same form factor other products causing problems

Method used

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  • Electronic module for chip card comprising a display screen
  • Electronic module for chip card comprising a display screen
  • Electronic module for chip card comprising a display screen

Examples

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Embodiment Construction

[0034] refer to Figure 1 to Figure 3 , which relates to the first embodiment of the present invention. The module 20 for the chip card is embedded in the cavity 21 of the card body, or in an equivalent support having a different form factor of the card body standardized according to the ISO 7816 standard. The module 20 comprises a first dielectric substrate 4 on one face of the module (typically the so-called upper face) and a second dielectric substrate 6 arranged on the other face (typically the lower face) of the module. On the face of the first substrate 4 oriented towards the interior of the module is secured a first microelectronic chip 8 , chips of the known type for chip cards. In the same way, a second microelectronic chip 7 is attached to the side of the second substrate 6 that is oriented towards the interior of the module. These two chips 7 and 8 are encapsulated and protected by encapsulation resin 5 .

[0035] In the example represented, the first chip 8 is a...

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Abstract

The invention relates to an electronic module (20) for a chip card comprising at least a first dielectric substrate (4) which is provided on one of the faces thereof with at least a first microelectronic chip (8) whose input / output terminals (9) are connected to first connection pins (2a) which are arranged around the first microelectronic chip (8), and at least a second dielectric substrate (6) which is placed directly opposite the first substrate (4) and which is provided on one of the faces thereof with at least a second microelectronic chip (7) whose input / output terminals are connected to second connection pins (2b) which are arranged around the second microelectronic chip (7), the first and second microelectronic chips (7, 8) being arranged on the faces of the substrates (6, 4) directed towards the interior of the electronic module, characterised in that it comprises a dielectric shim (3) which has a calibrated thickness and which separates the first and second dielectric substrates (4, 6), the shim (3) comprising through-holes (22, 220) or vacancies (24), in which electrically conductive materials (la, lb, le) which are capable of connecting some of the first connection pins (2a) to some of the second connection pins (2b) are arranged.

Description

technical field [0001] The invention relates to an electronic module, in particular for a smart card, comprising an electronic chip of the smart card, and a second electronic component, such as, for example, a display on one face of the module. Background technique [0002] In certain applications (especially banking applications) or for transactions over the Internet, to increase the security of chip cards, many chip cards include a dynamic code (called CVX) to replace the fixed CV (an acronym for the English term "Cardholder Verification (cardholder verification)") code. [0003] The display screen of the dynamic code is arranged in the same place as the usual fixed code, that is to say offset with respect to the position of the electronic module of the chip card and the contact terminal block of the electronic module, which is important for the two circuits that can communicate with each other For this purpose it is mandatory to have a flexible printed circuit (known in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077G06K19/07
CPCG06K19/07747G06K19/072G06K19/07707G06K19/0718G06K19/0723G06K19/07722G06K19/07773
Inventor K·法布里齐奥G·杰林
Owner SMART PACKAGING SOLUTIONS SPS