Developing, film-removing and etching device for high-density circuit board production, and implementation method thereof

Abstract

The invention discloses a developing, film-removing and etching device for high-density circuit board production, and relates to the technical field of circuit board etching. The developing, film-removing and etching device comprises an etching and film-removing device and a feeding hole formed in the upper end of the etching and film-removing device, a low-pressure tank is fixedly arranged on the bottom surface of an inner cavity of the feeding hole, and an inner cavity of the low-pressure tank is provided with an aqueous solution; and a pair of return pipes is arranged at the upper end of the top surface of the low-pressure tank, so that the rolling sodium hydroxide can accelerate the film stripping of the high-precision circuit board while the film stripping of the high-density circuit board is carried out. The invention further discloses an implementation method of the developing, film-removing and etching device for high-density circuit board production, third through holes are formed in the two sides of the upper end of the push plate, openings in the upper ends and the lower ends of the third through holes penetrate through the push plate, a second transverse plate is arranged between the inner cavity walls of the third through holes, a second gear is coupled to the upper end of the second transverse plate, and paddles are arranged at the upper end of the second gear. The sodium hydroxide is further stirred after the blades rotate, so that the turning effect of the sodium hydroxide is further improved.

Description

technical field [0001] The invention relates to the technical field of circuit board etching, in particular to a developing, film-removing and etching device for high-density circuit board production and an implementation method thereof. Background technique [0002] Etching is the technique of removing material using chemical reaction or physical impact. Etching technology can be divided into two types: wet etching and dry etching. It can be used to make printing concave-convex plates such as copper plates and zinc plates at the earliest. It is also widely used to reduce weight of instrument panels, nameplates and thin workpieces that are difficult to process by traditional processing methods. processing; after continuous improvement and development of process equipment, it can also be used for the processing of precision etching products of thin electronic parts in aviation, machinery, and chemical industries. Especially in semiconductor manufacturing processes, etching is...

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Problems solved by technology

[0003] When the current high-density circuit board is produced, it can be produced and shaped by the original board, and then it can be produced on a large scale. When the original board is etched, the circuit board needs to be removed. During the removal process, the circuit board needs to be placed In a container filled with sodium hydroxide, the solution inside the container is then heated by a quartz heating tube to accelerate the film removal reaction rate. However, after the circuit board is placed in the solution, the circuit cannot be accelerated through the tumbling solution due to the calm water surface. Stripping of the board

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