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Multi-material extensible strain sensor with paper-cut structure and preparation method of multi-material extensible strain sensor

A strain sensor, multi-material technology, applied in the field of biomedical electronics, can solve the problems of poor adhesion, limited deformation ability of complex curved surfaces attached to substrates, resistance change errors, etc., to reduce the influence of changes and improve the accuracy of unidirectional strain detection. Effect

Active Publication Date: 2021-12-21
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The sensor has a certain degree of extensibility due to the use of an elastic substrate, but it does not use a kirigami structure, and the deformation ability of the substrate attached to a complex curved surface is limited.
When the finger is bent at a large angle, it is easy to fall off from the surface of the finger, and the adhesion is poor
[0007] Therefore, it is necessary to develop a stretchable strain sensor with good extensibility, high strain accuracy in one direction, and strong adhesion, which can effectively solve the error introduced by the resistance change in the non-detection direction when the current strain sensor is deformed, and the demand for large-angle deformation of the finger Poor adaptability and other issues

Method used

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  • Multi-material extensible strain sensor with paper-cut structure and preparation method of multi-material extensible strain sensor
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  • Multi-material extensible strain sensor with paper-cut structure and preparation method of multi-material extensible strain sensor

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preparation example Construction

[0050] A method for preparing an extensible strain sensor with a multi-material kirigami structure, comprising the following steps:

[0051] Step 1: Attach the elastic substrate 5 on the glass sheet sprayed with a release agent;

[0052] Step 2: using a microelectronic printer to print the strain-sensitive conductive material 1 on the elastic substrate 5 by dispensing and drying, and the strain-sensitive conductive material 1 is distributed along the length direction of the elastic substrate 5;

[0053] Step 3: using a microelectronic printer to print the strain-insensitive conductive material 2 onto the elastic substrate 5 by inkjet and drying, the strain-insensitive conductive material 2 is distributed along the width direction of the elastic substrate 5, and is combined with the strain-sensitive conductive material 1 phase connection;

[0054] Step 4: bonding the external wires to the conductive material;

[0055] Step 5: Spin-coat a layer of liquid elastic silica gel on ...

specific Embodiment

[0060] like figure 2 As shown, the processing flow of a typical multi-material kirigami structure extensible strain sensor is mainly divided into the following steps:

[0061] The first step: attach the elastic substrate 5 to the glass sheet sprayed with a release agent;

[0062] The elastic base 5 is made of polydimethylsiloxane (PDMS), wherein the ratio of body A to curing agent B is 10:1, the thickness is 200 μm, the shape is rectangular, and the size is 30 mm×15 mm.

[0063] Step 2: Use a microelectronic printer to print the strain-sensitive conductive material 1 onto the elastic substrate 5 by dispensing. The material is distributed along the finger direction, that is, the length direction of the elastic substrate, and heated at 120° C. for 30 minutes.

[0064] The strain-sensitive conductive material 1 is made of carbon nanotubes.

[0065] Step 3: Use a microelectronic printer to print the strain-insensitive conductive material 2 onto the elastic substrate 5 by inkjet...

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Abstract

The invention discloses a multi-material extensible strain sensor with a paper-cut structure and a preparation method of the multi-material extensible strain sensor, a strain sensitive conductive material and a strain non-sensitive conductive material are combined, and the paper-cut structure is introduced to improve the overall extensibility and the attachment to fingers. The preparation method comprises the following steps: firstly, attaching an elastic substrate to a glass sheet; printing a conductive material on the elastic substrate and drying the conductive material; then bonding an external wire with the conductive material; continuously spin-coating a layer of liquid elastic silica gel above the glass sheet, and curing the liquid elastic silica gel to serve as a packaging layer; after assembling, completing graphical processing of a non-conductive material area of the strain sensor through laser cutting, and forming a paper-cut structure. The novel strain sensor has important practical value for improving single-direction strain precision and finger bending conformal capability, can effectively reduce resistance change errors in a non-detection direction of the strain sensor during finger bending deformation, and can better meet the requirement of large-angle bending through expansion deformation of a slit of the paper-cut structure.

Description

technical field [0001] The invention belongs to the technical field of biomedicine, and in particular relates to an extensible strain sensor and a preparation method thereof. Background technique [0002] In recent years, the development of flexible electronic strain sensing devices has been very rapid, which can be used to detect various human physiological activities, and has great application potential in the fields of human-computer interaction, health monitoring, and flexible electronic skin. However, most of the current strain sensor structure design is not highly optimized, and the adhesion is not good, so it is difficult to meet the deformation requirements when the finger is bent at a large angle. In addition, the strain sensor mostly uses a single strain-sensitive conductive material. When the finger is bent, the resistance change in the non-detection direction will easily introduce errors, resulting in a decrease in the accuracy of the sensor's detection of the st...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B7/16G01L1/18H05K3/12
CPCG01B7/20G01L1/18H05K3/12H05K3/1291
Inventor 吉博文阿凘荣胡志杰王慕尧曹馨月梁泽凯袁上钦冯慧成
Owner NORTHWESTERN POLYTECHNICAL UNIV