A chip double integrating sphere test device and test method

Abstract

The invention relates to the technical field of chip testing, in particular to a chip double integrating sphere testing device and a testing method. A chip double integrating sphere test device, comprising: a turntable with at least two test stations oppositely arranged; a driving structure arranged on one side of the turntable, including a bracket, a drive member connected to the bracket, and a drive member connected to the bracket Slidingly connected slide rails, two installation stations are arranged side by side on the bracket; the first test structure and the second test structure are respectively arranged on the two installation stations, and under the action of the driving member, the Test station alignment between the first test structure or the second test structure and the two setup stations. The invention provides a chip double integrating sphere testing device and testing method capable of measuring different powers and wavelengths at the same time and having high testing efficiency.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to a chip double integrating sphere testing device and a testing method. Background technique [0002] Chips are widely used in mobile terminals, computer equipment, face recognition, smart home, unmanned driving, aerospace and other fields. In the process of chip development and use, it is generally necessary to test a number of parameters of the chip (such as beam divergence angle, optical power, current, voltage, and wavelength of the spectrum, etc.) to determine whether the photoelectric characteristics and working status of the chip meet the requirements. . However, the existing chip test system can only test chips with a single range and range of power and wavelength. When it is necessary to test chips with power and wavelength beyond the range and range of the test system, the following two methods can only be adopted : One is that the existing test system configuratio...

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Problems solved by technology

[0003] Therefore, the technical problem to be solved by the present invention is to overcome the defects that the chip testing device in the prior art cannot measure chips of different powers and wavelengths at the same time, the operation is complicated, and the testing efficiency is low, thereby providing a low-cost, high testing efficiency , convenient and flexible, double integrating sphere test device and test method that can measure chips of different powers and wavelengths arbitrarily

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