Optical measurement method for printed circuit board
A printed circuit board, optical measurement technology, applied in image data processing, instruments, calculations, etc., can solve problems such as insufficient precision and increase system complexity, and achieve the effect of reducing material costs and simplifying maintenance.
Pending Publication Date: 2021-12-31
DONGGUAN ZHENGYANG ELECTRONICS MECHANICAL CO LTD
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Problems solved by technology
However, because it involves the displacement of the mechanism and the connection diagram, it requires precise mechanism positioning and program judgment of the software connection diagram, which increases a lot of system complexity.
If it is necessary to take a complete printed circuit board image at a time, there will be insufficient precision
Method used
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[0078] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.
[0079] Please refer to figure 1 Shown is a system block diagram of the optical measurement method for printed circuit boards provided by the first embodiment of the present invention. The optical measurement method of a printed circuit board can be performed by an optical measurement system 1, which includes a processor 2, a storage device 3, a camera 4 and a structured light device 5 (including an infrared transmitter and an infrared receiver), wherein the processor 2 is connected to the storage device 3. Camera...
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The invention discloses an optical measurement method for a printed circuit board. The method comprises the following steps: capturing a to-be-measured image of the printed circuit board; dividing the to-be-measured image into a plurality of to-be-measured sub-images according to a plurality of etching patterns on the printed circuit board, wherein the to-be-measured sub-images comprise the sub-etching patterns, and the sub-etching patterns comprise a plurality of bonding pads; accumulating the pixel brightness values of the to-be-measured sub-image in the short edge direction of the to-be-measured sub-image to obtain a plurality of first total pixel brightness values; differentiating the first total pixel brightness value to obtain horizontal axis pixel coordinates of the upper edge and the lower edge of each bonding pad; segmenting each to-be-measured sub-image according to the number of the bonding pads to form a plurality of bonding pad images; accumulating the pixel brightness values of the bonding pad image in the long edge direction of the to-be-measured sub-image to obtain a plurality of second total pixel brightness values; differentiating the second total pixel brightness value to obtain longitudinal axis pixel coordinates of the left edge and the right edge of each bonding pad;.
Description
technical field [0001] The invention relates to the technical field of precision measurement of printed circuit boards, in particular to an optical measurement method of printed circuit boards. Background technique [0002] The current measurement equipments all use small-angle optical systems to obtain sufficient resolution, so if you want to measure a printed circuit board, you usually need to take several shots and then combine the pictures one by one to form a complete printed circuit board image. However, because it involves the displacement of the mechanism and the connection diagram, precise mechanism positioning and program judgment of the software connection diagram are required, which increases a lot of system complexity. If it is necessary to take a complete printed circuit board image at a time, there will be insufficient precision. Therefore, it is very important to provide a printed circuit board measurement method that can also achieve measurement precision w...
Claims
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IPC IPC(8): G06T7/00G06T7/12G06T5/50
CPCG06T7/001G06T7/12G06T5/50G06T2207/10052G06T2207/30141G06T5/80
Inventor 江东恺
Owner DONGGUAN ZHENGYANG ELECTRONICS MECHANICAL CO LTD