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PCB board defect evaluation method, device, equipment and medium

A PCB board and defect technology, applied in the field of PCB board defect evaluation, can solve the problem of inability to evaluate the severity of PCB board defects, and achieve the effect of improving detection efficiency and detection accuracy

Active Publication Date: 2022-02-11
CHENGDU UNION BIG DATA TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The main purpose of this application is to provide a PCB board defect evaluation method, device, equipment and medium to solve the technical problem that the prior art cannot evaluate the severity of PCB board defects

Method used

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  • PCB board defect evaluation method, device, equipment and medium
  • PCB board defect evaluation method, device, equipment and medium
  • PCB board defect evaluation method, device, equipment and medium

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Embodiment Construction

[0069] It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0070] The main solution of the embodiment of the present application is to provide a PCB board defect assessment method, device, equipment and medium, by acquiring the target PCB board image, the PCB board in the target PCB board image has defects, and the target PCB board The image includes a bbox bounding box, and the defect is located in the bounding box; based on the target PCB board image, the first non-line area outline in the bounding box is obtained; based on the first non-line area outline, the obtained The circumscribed rectangular frame of the first non-line area outline; obtain the second non-line area outline in the circumscribed rectangular frame from the target PCB image; convert the pixel points in the second non-line area outline to Coordinate system, and by traversing the coordi...

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PUM

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Abstract

Embodiments of the present application provide a PCB board defect assessment method, device, equipment, and medium, by acquiring a target PCB board image; based on the target PCB board image, obtaining the outline of the first non-circuit area in the bounding box; based on the obtained Described first non-line area outline, obtain the circumscribed rectangular frame of described first non-line area outline; Obtain the second non-line area outline in described circumscribed rectangular frame from described target PCB board image; Described second The pixels in the outline of the non-line area are transformed into a coordinate system, and the minimum width value of the outline of the second non-line area is obtained by traversing the coordinates of the pixels in the outline of the second non-line area in the coordinate system ; Evaluate the severity of the defect according to the rectangle width value of the circumscribed rectangle frame and the minimum width value of the outline of the second non-line area. Fixed a technical issue where it was not possible to assess the severity of PCB board defects.

Description

technical field [0001] The invention relates to the technical field of PCB defect detection, in particular to a PCB defect evaluation method, device, equipment and medium. Background technique [0002] The production process of PCB boards is complicated, and defects may occur in every production link. Defective boards need to be discovered in time and prevented from entering the subsequent process to produce substandard products. Remaining copper defect is a common defect in the PCB production process. It is caused by excess copper on the PCB line. Too much protruding excess copper may cause the connection and short circuit of the circuit, resulting in the scrapping of the entire PCB board. Therefore, it is necessary to find out the remaining copper in time. copper defects and assess the severity of the defects. [0003] In the prior art, intelligent defect detection systems such as AOI and ADC can be used to realize real-time detection of PCB boards produced on-line, and d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06T7/00G06T7/70G06V10/764G06V10/82G06K9/62G06N3/04G06N3/08
CPCG06T7/0004G06T7/70G06N3/08G06T2207/10004G06T2207/10024G06T2207/20081G06T2207/20084G06T2207/30141G06N3/045G06F18/241
Inventor 不公告发明人
Owner CHENGDU UNION BIG DATA TECH CO LTD