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A test device for bonding strength between linear materials and substrates

A testing device and technology for bonding strength, applied in the field of testing devices for bonding strength between linear materials and substrates, can solve problems such as testing the bonding strength between linear materials and substrate surfaces, and achieve the effect of avoiding errors

Active Publication Date: 2022-06-28
LANZHOU UNIVERSITY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the market, the viscosity measurement of the adhesive itself or the bonding strength between the surface and the surface, and the line and the line material are usually carried out, and the existing test instruments are generally suitable for test pieces with similar sizes. There are no instruments available for the bond strength test between substrate surfaces

Method used

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  • A test device for bonding strength between linear materials and substrates
  • A test device for bonding strength between linear materials and substrates
  • A test device for bonding strength between linear materials and substrates

Examples

Experimental program
Comparison scheme
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Embodiment 1

[0030] The linear material 6 is an optical fiber as an example, such as Figure 1-3shown, the device is illustrated in detail. Specifically, the surface of one end of the base sample 3 is coated with an adhesive with a predetermined length, width and thickness, and the linear material 6 (optical fiber) is pasted on it in parallel, and after curing for a period of time, it is placed on the test platform 1 Place the base specimen 3 in the concave groove 4, adjust the test position of the base specimen 3 by moving the platform in the concave groove through the gear, and restrain the displacement in the Y direction by the bolts on the two side plates. At the same time, the X-direction displacement of the base specimen 3 is fixed with the limit baffle 5, the optical fiber 6 passes through the grid on the limit baffle 5, and the force value is set by the rotating fixture controller 15 so that the toothed jaws at the front end of the fixture clamp Tighten the unpasted end of the opt...

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PUM

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Abstract

The invention discloses a testing device for the bonding strength between a linear material and a substrate. The device includes a fixing device, a connecting device, a coaxial level detection and adjusting device, a driving device, a servo control device, a data acquisition device, a measuring device, seven main modules and other necessary connecting and fixing parts. One part of the fixing device is a concave groove, on which the displacement of the substrate in the Y direction is restrained by bolts, and the other part is a limit baffle, which constrains the displacement of the substrate in the X direction. The movement and fixation of the bit baffle. The invention is suitable for testing the bonding strength between various wires and surface materials. The fixing device can fix test specimens of various sizes and shapes, and can test various line materials such as optical fibers, optical cables, electric wires, and cables. The testing device has The characteristics of modularization, adjustable multi-size samples and parallel testing of multiple samples can solve the technical problems existing in the prior art.

Description

technical field [0001] The invention relates to the field of testing the bonding strength between materials, in particular to a testing device for bonding strength between a linear material and a substrate. Background technique [0002] Adhesive strength is an indicator that adhesive manufacturers must evaluate when testing product performance, and it is also an indicator for evaluating the bonding effect when two materials are bonded and fixed. The viscosity measurement of the adhesive itself or the test of the bonding strength between surface-to-surface, line-to-line materials is usually carried out on the market, and the existing test instruments are generally suitable for test pieces of similar size. There is no instrumentation available for bonding strength testing between substrate surfaces. Therefore, the present invention proposes a testing device for the bonding strength between a linear material and a substrate, which is suitable for testing the bonding strength b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N19/04
CPCG01N19/04
Inventor 原鹏博张文婷张景科李黎和法国刘小伟
Owner LANZHOU UNIVERSITY