Electronic equipment, shell and preparation method of shell
A technology for electronic equipment and casings, which is applied in the field of electronic equipment, casings and the preparation of casings, can solve problems such as uneven heat of mobile phone casings, and achieve the effects of facilitating heat conduction and improving handheld comfort.
Active Publication Date: 2022-01-11
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
This is because of different PCB schemes, the heat conduction to the phone case is not uniform
Method used
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Embodiment Construction
[0034] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments. In particular, the following examples are only used to illustrate the present invention, but not to limit the scope of the present invention. Likewise, the following embodiments are only some but not all of the embodiments of the present invention, and all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0035] Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present invention. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understoo...
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Abstract
The invention provides electronic equipment, a shell and a preparation method of the shell. The shell comprises a middle plate and a frame which are of an integrated structure, and the frame is arranged along the side edge of the middle plate. The shell is made of metal or alloy, and the grain size of the middle plate is larger than that of the frame. The shell for the electronic equipment provided by the embodiment of the invention is made of the metal or alloy material, the frame and the supporting middle plate which are of the integrated structure have different microstructure structures, grains of the middle plate are relatively thick and large, heat conduction is relatively fast, and heat conduction of a heating device in the electronic equipment is facilitated; the frame has fine crystal grains and more crystal boundaries and hinders heat conduction, so that heat of the center (middle plate) is not easy to conduct to the frame, a certain heat insulation effect is achieved, a user does not feel too hot when holding the frame, and the handheld comfort of the shell is improved.
Description
technical field [0001] The invention relates to the technical field of heat dissipation of electronic equipment, in particular to an electronic equipment, a housing and a method for preparing the housing. Background technique [0002] With the continuous progress of mobile communication technology, especially in the 5G era, the network delay is expected to reach 1ms, which will bring a smoother mobile network application and game experience. There are more and more corresponding applications on electronic devices represented by mobile phones, and more large-scale mobile games have appeared. These games have larger maps, finer scene details, and more dazzling action effects. The hardware configuration requirements of mobile phones are also getting higher and higher. We all know that mobile phones will heat up when playing games or watching dramas for a long time. This is because the CPU will generate heat when it runs at high speed. Higher! Therefore, mobile phone heat dis...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K5/02H05K7/20H04M1/02
CPCH05K5/0217H05K7/2039H04M1/0202H04M1/0279
Inventor 刘洋黄猛侯体波
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD