Method for manufacturing large touch sensing pattern

Abstract

The invention provides a method for manufacturing a large touch sensing pattern. The method comprises the following steps of dividing a large touch sensing pattern to be manufactured into a plurality of sub-patterns, and respectively manufacturing the sub-patterns into photomasks with corresponding patterns; providing a base material with a conductive layer; arranging a photosensitive resist layer on the conductive layer; a first exposure process, forming an exposure sub-pattern and a plurality of targets on the photosensitive resist layer; a sequential exposure process: forming a sequential exposure sub-graph and a plurality of targets on the photosensitive resist layer, the sequential exposure sub-graph being adjacently connected with the original exposure sub-graph; repeatedly implementing the sequential exposure process to form a plurality of sequential spliced exposure sub-patterns on the photosensitive resist layer until the exposure sub-patterns are spliced to form an integral exposure pattern; developing the overall exposure pattern on the photosensitive resist layer; and etching the conductive layer to form a large touch sensing pattern.

Description

technical field [0001] The invention relates to a method for manufacturing a large-scale touch sensing pattern, in particular to a method for combining a plurality of small-area exposure sub-patterns into a large-area overall exposure pattern, and then etching the overall exposure pattern to form a large-scale A method for manufacturing a touch-sensitive pattern. Background technique [0002] Touchpads have been widely used in various electronic products, and they are used in combination with touchpads with large screens, such as ATM cash machines, mutual assistance navigation systems in government agencies, electronic whiteboards in department stores, and vehicle touch devices. As well as various other industrial and commercial tools, in the past, due to factors such as the production technology and bonding yield of the touch panel, most of these devices that require touch applications are low-cost resistive or high-cost acoustic wave, plug-in Optical design; however, sinc...

AI Technical Summary

Problems solved by technology

[0004] As the size of the touch panel is getting bigger and bigger, it often exceeds the maximum size range that the industry's existing yellow light process machines can directly undertake the workpiece, resulting in the inability to form the overall touch sensing pattern in one light touch process. On the photoresist layer, it causes major production problems; however, it is expensive to purchase additional large-scale yellow light process machines, which will lead to a significant increase in production costs

[0005] At present, there are also attempts in the industry to produce the touch sensing pattern by segmental exposure and merging, that is, the overall touch sensing pattern is divided into multiple partial patterns, and then the exposure operation is performed separately, so as to form corresponding patterns on the photoresist layer. Curing the photoresist material, so that multiple partial patterns are merged into a complete touch sensing pattern on the photoresist layer; the merging process of the aforementioned multiple partial patterns needs to be accurately positioned, so as not to cause the combined composition of the whole An error occurs in the touch sensing pattern; the existing exposure process machine uses a CCD observation device as a positioning adjustment system, and the illumination source observed by the CCD uses blue light with a wavelength of 450~465nm; while the pattern on the photoresist layer in the aforementioned exposure process is The cured photoresist material is formed after exposure, and has not been processed by the development process. In practice, because the reflectivity of the cured photoresist material to the blue light source is relatively poor, the CCD observation device is very accurate for the target after exposure on the photoresist layer. Pattern TX has poor resolution issues (see Figure 15 ), making it difficult to locate accurately, resulting in an error in the overall touch-sensing pattern after the merger

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