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Non-conductive film and its forming method, chip packaging structure and method

A non-conductive film, non-conductive material technology, applied in circuits, electrical components, semiconductor devices, etc., can solve problems such as affecting chip stacking

Active Publication Date: 2022-04-01
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the heating and extrusion of the hot pressing process causes the non-conductive film between the chips to be extruded out of the chip, forming a thicker non-conductive film barrier layer at the edge of the chip, and the thicker barrier layer extruding out of the chip will affect The progress of the next die stack

Method used

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  • Non-conductive film and its forming method, chip packaging structure and method
  • Non-conductive film and its forming method, chip packaging structure and method
  • Non-conductive film and its forming method, chip packaging structure and method

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Embodiment Construction

[0058] Exemplary embodiments disclosed in the present application will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided for a more thorough understanding of the present application and for fully conveying the scope disclosed in the present application to those skilled in the art.

[0059] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features kno...

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Abstract

Embodiments of the present application provide a non-conductive film and its forming method, chip packaging structure and method, wherein the non-conductive film at least includes: a first film layer and a second film layer; the surface of the first film layer has A grid-shaped groove structure, and the depth of each groove in the groove structure is smaller than the thickness of the first film layer; the second film layer is located in the groove on the surface of the first film layer In; wherein, under the same conditions, the fluidity of the first film layer is greater than the fluidity of the second film layer.

Description

technical field [0001] The present application relates to the field of semiconductor technology, and relates to but not limited to a non-conductive film and its forming method, chip packaging structure and method. Background technique [0002] In the three-dimensional chip packaging process technology, the non-conductive film (Non Conductive Film, NCF) is used to paste the upper and lower chips during stack packaging, and the non-conductive film is used to paste the entire wafer to protect the bump (Bump). The wafer passes through the Backside Via Reveal (BVR) process and the cutting and slicing (Dicing) process to form multiple chips for a stacked chip structure; when stacking chips, Thermal Compression Bond (TCB) is used The process bonds the chips together. However, the heating and extrusion of the hot pressing process causes the non-conductive film between the chips to be extruded out of the chip, forming a thicker non-conductive film barrier layer at the edge of the ch...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/02H01L21/48H01L25/00H01L21/50
CPCH01L23/02H01L21/4803H01L25/00H01L21/50
Inventor 张志伟
Owner CHANGXIN MEMORY TECH INC