Dispensing machine for semiconductor

A glue dispenser and semiconductor technology, which is applied to the device for coating liquid on the surface, pretreatment surface, coating, etc., to achieve the effect of keeping clean and tidy, reducing glue drawing and ensuring quality
CN114042601BActive Publication Date: 2022-04-08江苏卓远半导体有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
江苏卓远半导体有限公司
Publication Date
2022-04-08

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Abstract

The present invention relates to the technical field of semiconductor processing equipment, in particular to a glue dispenser for semiconductors, including a body, a conveyor is installed on the top surface of the body, a bracket is fixedly connected to the top of the body, and a bracket is installed on one side of the bracket. A glue dispenser, the bottom surface of the glue dispenser is fixedly connected with a support sleeve, and the inside of the support sleeve is slidably connected with a dispensing column, and the inside of the dispensing column is provided with a plurality of dispensing tubes, and a plurality of the dispensing tubes are provided. The bottom surface of the dispensing tube communicates with the dispensing nozzle. In the present invention, the glue is injected by air pressure and moves to the dispensing nozzle through the dispensing tube, and the dispensing nozzle is moved out of the supporting sleeve to realize dispensing. The nozzle returns to the initial position. At this time, the transmission mechanism drives the opening and closing mechanism to close to protect the dispensing nozzle in the support sleeve, which protects the dispensing nozzle, and is also conducive to reducing the direct contact between the dispensing nozzle and the surface of the device and reducing glue. The drawing phenomenon appears.
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Description

technical field

[0001] The invention relates to the technical field of semiconductor processing equipment, in particular to a glue dispenser for semiconductors. Background technique

[0002] When processing semiconductor devices, different semiconductor materials are glued after being coated with glue on the surface of the materials by a glue dispenser. In the prior art, when a glue dispenser is used to drip glue on semiconductor devices, because part of the glue is relatively viscous and fluid, When the dispensing tube moves up and down, the glue dripping on the semiconductor device and the glue inside the dispensing tube are not easy to separate quickly, and the glue drips down under the gravity to form a wire drawing phenomenon, and it is easy to drip on the non-dispensing position of the semiconductor device, affecting The use of semiconductor devices increases semiconductor defective products, and in the process of dispensing, air is easy to seep into the dispensing tub...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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