Dispensing machine for semiconductor

Abstract

The present invention relates to the technical field of semiconductor processing equipment, in particular to a glue dispenser for semiconductors, including a body, a conveyor is installed on the top surface of the body, a bracket is fixedly connected to the top of the body, and a bracket is installed on one side of the bracket. A glue dispenser, the bottom surface of the glue dispenser is fixedly connected with a support sleeve, and the inside of the support sleeve is slidably connected with a dispensing column, and the inside of the dispensing column is provided with a plurality of dispensing tubes, and a plurality of the dispensing tubes are provided. The bottom surface of the dispensing tube communicates with the dispensing nozzle. In the present invention, the glue is injected by air pressure and moves to the dispensing nozzle through the dispensing tube, and the dispensing nozzle is moved out of the supporting sleeve to realize dispensing. The nozzle returns to the initial position. At this time, the transmission mechanism drives the opening and closing mechanism to close to protect the dispensing nozzle in the support sleeve, which protects the dispensing nozzle, and is also conducive to reducing the direct contact between the dispensing nozzle and the surface of the device and reducing glue. The drawing phenomenon appears.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing equipment, in particular to a glue dispenser for semiconductors. Background technique [0002] When processing semiconductor devices, different semiconductor materials are glued after being coated with glue on the surface of the materials by a glue dispenser. In the prior art, when a glue dispenser is used to drip glue on semiconductor devices, because part of the glue is relatively viscous and fluid, When the dispensing tube moves up and down, the glue dripping on the semiconductor device and the glue inside the dispensing tube are not easy to separate quickly, and the glue drips down under the gravity to form a wire drawing phenomenon, and it is easy to drip on the non-dispensing position of the semiconductor device, affecting The use of semiconductor devices increases semiconductor defective products, and in the process of dispensing, air is easy to seep into the dispensing tub...

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the above-mentioned technical problems, the object of the present invention is to provide a glue dispenser for semiconductors, which pushes the glue in the glue cartridge through the air pressure inside the glue dispenser, so that the glue is injected onto the top surface of the glue dispensing column, and the air pressure continues to inject The glue makes the glue move down the dispensing tube to the inside of the dispensing nozzle. Since the dispensing column is not a hollow tubular structure, and the inside of the dispensing column is embedded in a fixed dispensing tube with multiple bends in the middle, it is convenient for the glue to squeeze the dispensing column. When the top surface moves to the dispensing tube, the dispensing column moves down along the inner wall of the support sleeve with the dispensing nozzle, so that the dispensing nozzle can be moved out of the dispensing, and multiple bends in the middle of the dispensing tube are also convenient to prevent fluid The glue falls by itself under the action of gravity and pollutes the conveyor. A connection block is fixedly connected to the inner wall of the support sleeve. The end of the connection block located in the accommodating cavity of the dispensing column is fixedly connected with a circular block 1 and a circular block 1. There is a return spring fixedly connected to the accommodation cavity. When the dispensing column moves down, the return spring is in a compressed state. As the glue in the dispensing nozzle drips onto the semiconductor device, the weight of the dispensing column is reduced, and the elastic force of the return spring Under the action, the dispensing column moves up with the dispensing tube and the dispensing nozzle and is stored in the support sleeve, which protects the dispensing nozzle, and is also conducive to reducing the direct contact between the dispensing nozzle and the surface of the device, keeping the outer wall of the dispensing nozzle clean and tidy, Reduce the phenomenon of glue drawing, and during the upward movement of the dispensing column, the top surface of the dispensing column will squeeze the glue on the top of the supporting sleeve, so that the glue on the top surface of the dispensing column and the glue inside the dispensing tube are in a full state, preventing direct air infiltration Inject glue, resulting in glue bubbling, which ensures the quality of dispensing;

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