Heat dissipation structure and electronic equipment

Abstract

The embodiment of the invention relates to the field of electronic equipment, and provides a heat dissipation structure and electronic equipment. The heat dissipation structure comprises a heat conduction part, wherein the heat conduction part comprises a first heat conduction layer, a connection part and a second heat conduction layer, the first heat conduction layer is opposite to the second heat conduction layer, and the connection part is bendable; a first heat dissipation layer which is located on one side of the first heat conduction layer; and a second heat dissipation layer which is located on one side, wherein the second heat dissipation layer and the first heat dissipation layer are located on the two opposite sides of the connecting part respectively. The heat dissipation structure and the electronic equipment provided by the embodiment of the invention are at least beneficial to solving the problem of poor heat dissipation effect.

Description

technical field [0001] The embodiments of the present application relate to the field of electronic equipment, and in particular to a heat dissipation structure and electronic equipment. Background technique [0002] With the high frequency and high speed of electronic devices and the rapid development of integrated circuit technology, the functions of electronic devices are becoming more and more powerful, and the heat generated is also increasing. Heat can impair the performance and even reduce the lifespan of these devices. For example, prolonged use of a mobile phone will cause severe heat generation of the processor and the screen, and the heat generation will further affect the service life of the Organic Light-Emitting Diode (OLED) screen. [0003] The heat dissipation of electrical devices is to control the operating temperature of electronic equipment, so as to ensure the temperature and safety of its work, which mainly involves different aspects of heat dissipatio...

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Problems solved by technology

[0004] Embodiments of the present application provide a heat dissipation structure and electronic equipment, which at least help to solve the problem of poor heat dissipation

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