Testing probe system for testing semiconductor die, multi-channel die having shared pads, and related systems and methods

Abstract

A testing probe system for testing a semiconductor die, a multi-channel die having shared pads, and related systems and methods. The testing probe system includes probes configured to contact shared probe pads of multi-channel die of a wafer; and a controller configured to generate testing patterns and receive signals from the multi-channel die of the wafer. The controller is configured to contact a probe of the probes with a shared probe pad of the multi-channel die, select a first channel of the multi-channel die to test, select at least one test mode for testing the first channel, stimulate at least the first channel during a single contact period, acquiring a first output of the first channel during the single contact period, select a second channel of the multi-channel die to test, select at least one test mode for testing the second channel, stimulate at least the second channel during the single contact period, and acquire a second output of the first channel during the single contact period.

Description

[0001] priority claim [0002] This application claims "TESTING PROBE SYSTEM FOR TESTING SEMICONDUCTOR DIE, MULTI-CHANNEL DIE" filed on July 7, 2020 HAVING SHARED PADS, AND RELATED SYSTEMSAND METHODS)" U.S. Patent Application Serial No. 16 / 922,458". technical field [0003] Embodiments of the present disclosure generally relate to test probe systems for testing semiconductor die, methods of testing multiple channels of a given multi-channel die via a single contact cycle, and related systems and methods. Background technique [0004] Semiconductor die are routinely fabricated in large area wafers such that hundreds or thousands of identical individual dies are fabricated simultaneously. This die may include diodes, transistors, MOSFETs, insulated gate bipolar transistors, and the like. After formation, the wafer's die may be tested for certain characteristics via testing equipment (commonly referred to as "wafer probe" or "probe" testing). Typical die testing involves op...

AI Technical Summary

Problems solved by technology

As a result, testing a die with a dual channel configuration takes twice as long, which can result in reduced overall die yield and / or significant test system modifications

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