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Semiconductor device

A technology of semiconductors and transistors, applied in the field of semiconductor devices, can solve problems such as thermal damage and temperature rise of semiconductor chips, and achieve the effect of improving the overheating protection function

Pending Publication Date: 2022-03-01
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the conventional technology, the temperature of the entire semiconductor chip can be detected with high accuracy, but there is a problem that since there is only one temperature detection unit, it cannot follow the rapid temperature of each of the transistor unit and the diode unit. rise, thermal destruction of the semiconductor chip occurs before the overheating of the transistor part and the diode part is detected

Method used

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  • Semiconductor device
  • Semiconductor device
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Embodiment approach 2

[0036] Next, the semiconductor device 100 according to Embodiment 2 will be described. image 3 It is a schematic diagram showing the structure of the upper surface of the semiconductor device 100 according to the second embodiment. Figure 4 It is a schematic diagram showing the structure of the upper surface of another example of the semiconductor device 100 according to the second embodiment. In addition, in Embodiment 2, the same constituent elements as those described in Embodiment 1 are given the same reference numerals and descriptions thereof are omitted.

[0037] Such as image 3 and Figure 4 As shown, in Embodiment 2, one end of a plurality of external wires 8 is connected to the unit 3 adjacent to the unit 3 in which the temperature detection unit 6 and the temperature detection unit 7 are respectively arranged. and figure 1 Since one end of the plurality of external wires 8 is connected to a position closer to the temperature detection unit 6 and the temperature...

Embodiment approach 5

[0052] Next, the semiconductor device 100 according to Embodiment 5 will be described. In addition, in Embodiment 5, the same constituent elements as those described in Embodiments 1 to 4 are given the same reference numerals, and description thereof will be omitted.

[0053] In Embodiment 5, the temperature detection unit 6 is set with a temperature at which the overheat protection of the transistor unit 4 is started, that is, the first protection threshold, and the temperature detection unit 7 is set with the temperature detection unit 7 with the temperature at which the diode unit 5 is started with overheat protection, that is, the first protection threshold. 2 Protection threshold. In addition, the second protection threshold is set at a temperature lower than the first protection threshold.

[0054] The semiconductor device 100 is sometimes used in a servo system, and in particular, there is a lock mode in which the diode unit 5 becomes overheated in the servo system. W...

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Abstract

The purpose of the present invention is to provide a semiconductor device in which the temperature of a transistor section and the temperature of a diode section can be detected with high accuracy, and an overheat protection function can be improved. A semiconductor device (100) is provided with: a semiconductor chip (50) having a cell region (1) comprising a plurality of cells (3) including cells (3) corresponding to transistor sections (4) and diode sections (5) respectively; a temperature detection unit (6) that detects the temperature of the transistor unit (4); and a temperature detection unit (7) that detects the temperature of the diode unit (5), the temperature detection unit (6) being disposed in the cell (3) corresponding to the transistor unit (4), and the temperature detection unit (7) being disposed in the cell (3) corresponding to the diode unit (5).

Description

technical field [0001] The present invention relates to a semiconductor device including a semiconductor chip and a temperature detection unit. Background technique [0002] Conventionally, there has been a semiconductor device including: a semiconductor chip having a cell region composed of a plurality of cells including cells corresponding to each of a transistor portion and a diode portion; The temperature is detected. A semiconductor device is known (see, for example, Patent Document 1) capable of appropriately detecting the temperature of a semiconductor chip by connecting one end of an external wiring to a unit around the temperature detecting unit. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2019-186510 [0004] In recent years, semiconductor devices are frequently used in applications where a load is applied to either a transistor unit or a diode unit. Since the temperature of the portion where the load is applied to the transistor unit and the diode...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/34G01K7/01
CPCH01L23/34G01K7/01G01R31/2628G01R31/2632G01R31/3274H01L2224/49111H01L2224/49175H01L2224/4846H01L2224/0603
Inventor 日高大树江口佳佑青木伸亲米山玲
Owner MITSUBISHI ELECTRIC CORP