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Device for laminating outer layer copper on multi-layer circuit board

A multi-layer circuit board and outer layer technology, which is applied in the direction of multi-layer circuit manufacturing, circuit board tool positioning, printed circuit, etc. Speed, easy to adjust effect

Inactive Publication Date: 2022-03-01
绍兴华创光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a multilayer circuit board pressing outer layer copper device to solve the problem that the pressing outer layer copper device is not convenient for automatic clamping and conveying of multilayer circuit boards in the above-mentioned background technology

Method used

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  • Device for laminating outer layer copper on multi-layer circuit board
  • Device for laminating outer layer copper on multi-layer circuit board
  • Device for laminating outer layer copper on multi-layer circuit board

Examples

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] see Figure 1-6 , an embodiment provided by the present invention: a multilayer circuit board pressing outer layer copper device, including a copper-plated press box 1, a copper-plated press 2, a limit rod 3, a limit block 17 and a drive rod 18. The copper-plated press box 1 is equipped with a copper-plated press 2, and the outer wall of the copper-plated press 2 is slidingly connected with the copper-plated press box 1, and the copper-plated press below the copper-plated press 2 There are two sets of rails 11 installed inside the box 1, and the bottom end of th...

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Abstract

The invention discloses a multilayer circuit board outer layer copper pressing device which comprises a copper plating pressing box, a copper plating pressing device, a limiting rod, a limiting block and a driving rod, the copper plating pressing device is installed in the copper plating pressing box, the outer wall of the copper plating pressing device is in sliding connection with the copper plating pressing box, two sets of rails are installed in the copper plating pressing box below the copper plating pressing device, and the two sets of rails are in sliding connection with the limiting rod. The bottom end of the rail is fixedly connected with the copper plating press-fit box, the clamp box is installed in the copper plating press-fit box above the rail, four sets of walking wheels are installed at the bottom end of the clamp box, the bottom ends of the walking wheels are slidably connected with the rail, and the lengthened electric rod is installed in the copper plating press-fit box on one side of the rail. According to the invention, automatic clamping and conveying of the multilayer circuit board by the outer layer copper pressing device are realized, the processing speed of the multilayer circuit board is accelerated, and harmful gas is prevented from overflowing when the outer layer copper pressing device works.

Description

technical field [0001] The invention relates to the technical field of pressing and bonding outer layer copper devices, in particular to a multilayer circuit board pressing and bonding outer layer copper device. Background technique [0002] Multilayer circuit boards have the advantages of high assembly density, small size, and light weight. Due to the high assembly density, the connections between components are reduced, thus improving the reliability of multilayer circuit boards. Circuit and magnetic circuit shielding layers can be set. A metal core heat dissipation layer can also be provided to meet the needs of special functions such as shielding and heat dissipation. At the same time, it has the characteristics of simple installation and high reliability. Multilayer circuit boards are generally made of epoxy glass cloth copper-clad laminates. It is developed on the basis of the technology of double-sided panels with holes. Its general process is to etch the graphics of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/00B01D53/04B01D46/10
CPCH05K3/4611H05K3/0008B01D53/04B01D46/10
Inventor 刘一锋张志强
Owner 绍兴华创光电科技有限公司
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