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Disqualified wafer detection device and detection method, and wafer manufacturing equipment

A wafer, qualified technology, applied in semiconductor/solid-state device manufacturing, sorting, electrical components, etc., can solve problems such as unqualified wafers, complex processes and devices, and large wafer inspection volume, so as to improve production capacity and increase Measuring the effect of the skip rate and

Pending Publication Date: 2022-03-18
INST OF MICROELECTRONICS CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above analysis, this application aims to provide a detection device and detection method for unqualified wafers, and wafer manufacturing equipment to solve the problem of large wafer detection, long time, and complicated processes and devices in the prior art. question

Method used

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  • Disqualified wafer detection device and detection method, and wafer manufacturing equipment
  • Disqualified wafer detection device and detection method, and wafer manufacturing equipment
  • Disqualified wafer detection device and detection method, and wafer manufacturing equipment

Examples

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Effect test

Embodiment 1

[0058] This embodiment provides a detection device for unqualified wafers, see Figure 1 to Figure 7 , including a light source (light in the field of visible light source), a photoelectric sensor and a controller. The light source and the photoelectric sensor are located on the same side of the wafer to be inspected. The reflected light signal is converted into an electrical analog signal, and the controller receives the electrical analog signal sent by the photoelectric sensor and converts it into electrical data, compares the electrical data with the electrical reference data, and judges whether the wafer to be inspected is qualified or not.

[0059] It should be noted that in the semiconductor manufacturing process, according to the wavelength of light reflected by the film exposed on the surface of the wafer, the wafer will show an inherent color. The circles should have similar surface colors. However, the surface color of the wafer will vary due to the difference in th...

Embodiment 2

[0073] This embodiment provides a method for detecting unqualified wafers, see Figure 8 , including the following steps:

[0074] Turn on the light source; the light emitted by the light source is reflected by the surface of the wafer to be inspected and then enters the photoelectric sensor, and the photoelectric sensor converts the reflected light signal into an electrical analog signal; the controller receives the electrical analog signal sent by the photoelectric sensor and converts it into electrical data; The data is compared with the electrical reference data. If the electrical data is within the range of the electrical reference data, it is judged that the wafer to be inspected is qualified. If the electrical data is not within the range of the electrical reference data, it is judged that the wafer to be inspected is unqualified.

[0075] Compared with the prior art, the method for detecting unqualified wafers provided in this embodiment has basically the same benefici...

Embodiment 3

[0091] This embodiment provides a wafer manufacturing equipment, see Figure 9 , including the detection device for unqualified wafers provided in Embodiment 1.

[0092] Compared with the prior art, the beneficial effects of the wafer manufacturing equipment provided in this embodiment are basically the same as those of the device for detecting unqualified wafers provided in the first embodiment above, and will not be repeated here.

[0093] It should be noted that the detection equipment can be set at any position in the wafer manufacturing equipment where the wafer can be irradiated. In practical applications, it can be set according to the specific structure of the wafer manufacturing equipment and the position where the wafer needs to be inspected. Exemplarily, the above-mentioned wafer manufacturing equipment further includes a processing chamber and a transfer chamber, and the detection device is disposed between the processing chamber and the transfer chamber, or the de...

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PUM

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Abstract

The invention discloses a device and a method for detecting unqualified wafers and wafer manufacturing equipment, belongs to the technical field of semiconductor manufacturing, and aims to solve the problems of large wafer detection quantity, long time and complex process and device in the prior art. The detection device comprises a light source, a photoelectric sensor and a controller, wherein the light source and the photoelectric sensor are positioned on the same side of the wafer to be detected. The detection method comprises the steps of turning on a light source; light emitted by the light source is reflected by the surface of the wafer to be detected and then enters the photoelectric sensor, and the photoelectric sensor converts a reflected light signal into an electric analog signal; the controller receives the electric analog signal sent by the photoelectric sensor and converts the electric analog signal into electric data; and comparing the electric data with the electric reference data, if the electric data is within the electric reference data range, judging that the wafer to be detected is qualified, and if the electric data is not within the electric reference data range, judging that the wafer to be detected is unqualified. The detection device, the detection method and the wafer manufacturing equipment can be used for detecting unqualified wafers.

Description

technical field [0001] The application belongs to the technical field of semiconductor manufacturing, and in particular relates to a detection device and detection method for unqualified wafers, and wafer manufacturing equipment. Background technique [0002] In the semiconductor manufacturing process, it is very ideal that wafers of the same batch (Lot) using the same process in the same processing chamber exhibit the same process results. However, in reality, the process results of wafers will vary due to the existence of many variables (eg, people, machines, materials, methods, environment, etc.). [0003] In order to detect unqualified wafers caused by variables, an additional inspection device is usually installed after the wafer manufacturing is completed, and it takes a lot of time to inspect all the wafers. Contents of the invention [0004] In view of the above analysis, this application aims to provide a detection device and detection method for unqualified wafe...

Claims

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Application Information

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IPC IPC(8): B07C5/344H01L21/67
CPCB07C5/344H01L21/67271
Inventor 郑宇现周娜李琳杨涛李俊峰王文武
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI