Substrate conveying method and device

Abstract

The invention relates to a substrate conveying method and a substrate conveying device. The substrate conveying method comprises the following steps of: providing a substrate on the surface of a first plate body in a first position; shifting the first plate body from the first position to a second position which is positioned in the upper space of a second plate body; and lifting the substrate from the surface of the first plate body and placing the substrate from the upper space on the surface of the second plate body. The substrate conveying device comprises the first plate body and the second plate body, wherein the first plate body and the second plate body are respectively provided with surfaces for carrying the substrate; and the first plate body can move between the first position and the second position. The substrate conveying method or device of the invention can obviously reduce conveying time and improve the capacity of a heating process. In addition, the invention obviously reduces the conveying time and effectively reduces the temperature reduction in the conveying process, thereby more easily controlling heat quantity and the reduction of an opening and the key size.

Description

technical field [0001] The invention relates to a substrate transfer method and its device, in particular to a method and device for transferring a wafer between hot plates. Background technique [0002] A hot plate is a widely used tool for heating solids or liquids. For a thermal manufacturing process that includes two or more stages of different temperatures, the same corresponding number of heating plates is often used to achieve continuous processing of multiple substrates. For example, a photoresist reflow process generally includes two heating steps at different temperatures, and two heating plates are used for each heating step. [0003] figure 1 It is a temperature curve of a photoresist reheat flow manufacturing process of a conventional two-step thermal manufacturing process. The patterned photoresist layer 110 is formed on the substrate 100 and has an opening 120 , and a reheat flow process is performed on the patterned photoresist layer 110 to reduce the size...

AI Technical Summary

Problems solved by technology

However, since it takes a considerable amount of time to move using the robotic arm ( figure 1 In the t2-t3 period, about 8-15 seconds), the effective temperature (significant temperature) will drop during the transmission time, causing the thermal dosage (thermal dosage) and the shrinkage and critical dimension (critical dimension, CD) of the resulting opening )hard to control

In addition, slow substrate transfer reduces throughput

[0005] This shows that the above-mentioned existing substrate transfer method and its device obviously still have inconvenience and defects in the method, product structure and use, and need to be further improved urgently.

In order to solve the above-mentioned existing problems, relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable method and structure for general methods and products to solve the above-mentioned problems. This is obviously a problem that relevant industry players are eager to solve

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