Automatic simulation loop impedance matching detection method

A technology of impedance matching and detection method, applied in the field of communication, can solve the problems of time-consuming and laborious testing, and achieve the effect of improving accuracy, improving sound quality and improving use effect.

Pending Publication Date: 2022-04-01
SHENZHEN DINSTAR TECH
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an automatic analog loop impedance matching detection method to solve the problem of manually configuri

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Automatic simulation loop impedance matching detection method
  • Automatic simulation loop impedance matching detection method
  • Automatic simulation loop impedance matching detection method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0027] Next, the technical scheme in the embodiment of the present invention will be clearly and completely described, and it is understood that the described embodiments are merely intended to be the embodiment of the present invention, and Not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art are in the range of the present invention without making creative labor premise.

[0028] See Figure 1-3 The present invention provides a technical solution: an automatic analog loop impedance matching detection method, including the steps of:

[0029] The impedance automatic matching system composed of the CPU-based DSP processing system and the SLIC chip is used to automatically perform impedance match between user loop transmission lines and signal sources to obtain the best matching impedance signal, CPU-based DSP processing system Includes CPUs and DSPs that interact with each other;

[0030] Set the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an automatic simulation loop impedance matching detection method, and the method comprises the following steps: automatically carrying out the impedance matching between a user loop transmission line and a signal source through employing an impedance automatic matching system which is formed through the interaction of a DSP processing system based on a CPU and an SLIC chip, an optimal matching impedance signal is obtained; and the optimally matched impedance value is set in the SLIC, so that the quality is optimal when the signal is transmitted to the stored program control exchange. According to the invention, the manual test intensity can be reduced, the test time can be shortened, and the matching accuracy can be improved, so that the communication quality is improved, the tone quality level of a call is improved, the noise is reduced, and the communication quality and the communication success rate of data terminals including fax, pos machines and other communication equipment are improved.

Description

technical field [0001] The invention relates to the communication field, in particular to automatic impedance matching of telephone lines by using reflected signal strength, in particular to an automatic analog loop impedance matching detection method. Background technique [0002] The current voip analog gateway gateway adopts a dedicated interface chip to realize the BORSCHT function of simulating the user loop, which not only uses the slic interface chip of the analog phone; , the length of the line, the user loop impedance of the central office switch that the line is connected to, etc., will cause a mismatch in the impedance of the gateway configuration, resulting in poor voice quality, noise, poor fax effect, and modem communication errors, etc. Condition. [0003] In view of this situation, slic has a register to perform impedance matching to improve the effect of communication. However, due to the inconsistent characteristics of various lines, even in the same count...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G05B19/042
Inventor 卢瑞昕
Owner SHENZHEN DINSTAR TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap