Evaporation device and manufacturing method of evaporation device

A production method and evaporation technology, which are applied in vacuum evaporation plating, sputtering plating, ion implantation plating and other directions, can solve the problem of particles remaining in the substrate, and achieve the effect of improving display performance

Pending Publication Date: 2022-04-05
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The embodiment of the present application provides an evaporation device and a manufacturing method of the evaporation

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  • Evaporation device and manufacturing method of evaporation device
  • Evaporation device and manufacturing method of evaporation device
  • Evaporation device and manufacturing method of evaporation device

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[0039] The technical solutions in the present application embodiment will be described in conjunction with the drawings in the present application embodiment. Obviously, the described embodiments are merely the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present application, those skilled in the art will belong to the scope of this application without all other embodiments obtained without creative labor.

[0040] In the description of this application, it is to be understood that the terms "center", "longitudinal", "horizontal", "length", "width", "thickness", "upper", "under", "front", " After "," left "," right "," vertical "," horizontal "," top "," bottom "," inside "," external "," clockwise "," counterclockwise "or other indication or The positional relationship is based on the orientation or positional relationship shown in the drawings, is merely described in order to facilitate the description of the present applicati...

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Abstract

The invention provides an evaporation device and a manufacturing method of the evaporation device. The evaporation device comprises an evaporation cavity and an adsorption assembly, the adsorption assembly is used for adsorbing particles in the evaporation cavity, and the adsorption assembly comprises a first part located in the evaporation cavity and a second part located outside the evaporation cavity; and the conveying assembly is provided with the first part and the second part, and when preset conditions are met, the conveying assembly drives the first part to move out of the evaporation cavity and drives the second part to move into the evaporation cavity. According to the embodiment of the invention, the adsorption assembly is automatically replaced through the conveying assembly to enable the new adsorption assembly to absorb the particles, so that the particles are prevented from being deposited on the anti-adhesion plate in the evaporation cavity, the condition that the particles are introduced to the substrate when the display panel is prepared is avoided, the problem that the particles are left on the substrate due to a heating evaporation mode is solved, and the production efficiency is improved. And the display performance of the organic display device is improved.

Description

technical field [0001] The present application relates to the field of display technology, in particular to an evaporation device and a manufacturing method of the evaporation device. Background technique [0002] The main method of making OLED devices is heating evaporation coating, mainly using a heating container to heat the evaporation material in a vacuum environment, so that the sublimation or molten evaporation material is vaporized at high temperature, and deposited on the TFT structure or anode structure. on the substrate. [0003] However, this method of heating and evaporating will cause particles to remain on the substrate, which will affect the display performance of the organic display device. Contents of the invention [0004] The embodiment of the present application provides an evaporation device and a manufacturing method of the evaporation device, which solves the problem that particles remain on the substrate caused by the existing heating and evaporat...

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Application Information

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IPC IPC(8): C23C14/24C23C14/56
Inventor 梅亚梦覃事建
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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