Substrate mother board, preparation method thereof, driving substrate and display device

Abstract

The invention provides a substrate mother board, and the substrate mother board comprises a substrate which is divided into an effective region used for forming a driving substrate, and a non-effective region located at the periphery of the effective region; the first conductive layer pattern is located on the substrate and comprises a plurality of signal wires located in the effective area; the first insulating layer is positioned on one side, far away from the substrate, of the first conductive layer pattern; the second conducting layer pattern is located on the side, away from the substrate, of the first insulating layer and comprises a plurality of connecting terminals located in the effective area, and the connecting terminals are electrically connected with the corresponding signal wires; at least one connecting terminal is provided with a corresponding leading-out wire and a detection terminal, the detection terminal is located in the non-effective area, and the leading-out wire is electrically connected with the corresponding connecting terminal and led out to the non-effective area to be electrically connected with the corresponding detection terminal. The embodiment of the invention further provides a preparation method of the substrate mother board, a driving substrate and a display device.

Description

technical field [0001] The invention relates to the field of display, in particular to a substrate motherboard and a preparation method thereof, a driving substrate and a display device. Background technique [0002] As a new generation of display technology, Micro / Mini-LED display technology has the advantages of high brightness, good luminous efficiency, and low power consumption. The driving substrate is the core part of the LED display device; in the actual production process, firstly, various functional film layers are prepared on the surface of the large-size substrate substrate to obtain the substrate mother board; then through the cutting equipment (usually a laser cutting machine) The substrate motherboard is cut to obtain a small-sized drive substrate. [0003] Before cutting the substrate motherboard, various tests are performed on the substrate motherboard, such as open circuit and short circuit test (Opens and Shorts Test), and based on the test results, the pr...

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Problems solved by technology

[0004] When testing, it is necessary to contact the probes of the test instrument with the corresponding connection terminals on the substrate motherboard; in the actual test process, it is found that with the high resolution of the product, the size of the connection terminals is reduced accordingly, and the probes The alignment and contact process with the connection terminal becomes very difficult; in addition, the connection terminal is easy to be scratched during the contact between the probe and the connection terminal

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