Rapid pressing device based on 5G optical module PCB

Abstract

The invention belongs to the field of PCB pressing plate production, and particularly relates to a rapid pressing device based on a 5G optical module PCB, which comprises a machine body, a bottom plate and a top plate, a bottom plate is fixedly connected to the position, close to the bottom of the machine body, in the machine body. A first copper foil, a first prepreg, an inner-layer core plate, a second prepreg and a second copper foil are sequentially arranged at the top of the bottom plate; air guide holes are uniformly formed in the surfaces of the first prepreg and the second prepreg; air guide channels are formed in the first prepreg and the second prepreg; the interior of the machine body is fixedly connected with a telescopic rod; the bottom surface of the telescopic rod is fixedly connected with a top plate; the interior of the top plate is fixedly connected with a heating block; the structure of the first prepreg and the structure of the second prepreg are improved, so that when the PCB is pressed by the pressing device, internal trapped air can be quickly discharged through the air guide holes and the air guide channels, the air trapping problem is reduced, and the quality of a pressed product is improved.

Description

technical field [0001] The invention belongs to the field of PCB pressing plate production, and specifically relates to a quick pressing device based on a 5G optical module PCB. Background technique [0002] The 5G optical module is composed of optoelectronic devices, functional circuits and optical interfaces. The optoelectronic devices include two parts: transmitting and receiving. The software and hardware of the 5G network need to be upgraded. During the construction period, the transmission equipment mainly includes communication equipment PCBs, optical modules and optical devices. , fiber optic cable, transmission supporting equipment. [0003] The publication number is CN104519678B, a method for pressing PCB boards. Several types of PCB boards to be pressed are placed on the same pressing machine with several pressing parts for pressing. The material parameters of each PCB board and the adjacent The area difference of different types of PCB boards to be pressed is ar...

AI Technical Summary

Problems solved by technology

[0004] In the prior art, there is a pressing step in PCB processing, which is to press the copper foil and the medium together. Before the existing pressing, it is necessary to stack the boards. The process of stacking the boards must be carried out in a clean room, and the room The temperature and humidity should be controlled accordingly. The purpose is to avoid the defects of foaming, layer opening or plate bending as much as possible during the pressing process. However, during the lamination process of the existing first prepreg and the second prepreg, it is easy to internal Trapped air, and during the pressing process, it is difficult to discharge the trapped gas in the content, resulting in poor processing

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