Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A circuit protection structure of a power management chip and its working method

A power management chip and circuit protection technology, which is applied in the field of circuits, can solve the problems that the circuit board shell cannot be assembled, the rebound performance of the press switch is reduced, etc.

Active Publication Date: 2022-07-01
HENAN XINRUI ELECTRONICS TECH
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Power management equipment includes circuit boards and power management chips. When assembling power management equipment, the power management chip needs to be installed on the circuit board. At the same time, the switch will be installed on the circuit, and then the shell will be installed on the circuit board. Most of the current switches use push back The elastic switch, but after long-term use, the rebound performance of the push switch is significantly reduced. At the same time, when the circuit board and the shell are assembled, it is often encountered that the circuit board cannot be assembled with the shell due to the angle problem.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A circuit protection structure of a power management chip and its working method
  • A circuit protection structure of a power management chip and its working method
  • A circuit protection structure of a power management chip and its working method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention. Thus, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "vertical", "horizontal", "inne...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of circuits, in particular to a circuit protection structure of a power management chip and a working method thereof, including a circuit board, a push switch body mounted on the circuit board, and a mounting device for easy assembly provided on the circuit board The circuit board is provided with a rebound component that assists the rebound of the push switch body, the circuit board is provided with a heat dissipation component that dissipates heat from the circuit board, and the heat dissipation component is provided with a preload for the mounting component. The purpose of the present invention is to provide a circuit protection structure for a power management chip, which can flexibly adjust the angle of the circuit board, avoid the circuit board from being unable to be assembled with the casing due to the angle of the circuit board, and at the same time can help the push switch body. Rebound after pressing, avoid pressing the switch body for a long time, and the rebound performance will deteriorate and cannot fully rebound. In addition, the circuit board can be dissipated to avoid a large amount of heat generated by the circuit board, which will affect the normal operation of the circuit board.

Description

technical field [0001] The invention relates to the technical field of circuits, in particular to a circuit protection structure of a power management chip and a working method thereof. Background technique [0002] The power management device includes a circuit board and a power management chip. When assembling the power management device, the power management chip needs to be installed on the circuit board. At the same time, a switch will be installed on the circuit, and then the casing will be installed on the circuit board. Most of the current switches are pressed back. However, after long-term use, the resilience performance of the push switch is significantly reduced. At the same time, when the circuit board is assembled with the casing, the problem that the circuit board cannot be assembled due to the angle problem and the casing is often encountered. SUMMARY OF THE INVENTION [0003] The purpose of the present invention is to provide a circuit protection structure ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H02M1/00H05K7/12H05K7/14H05K7/20
CPCH02M1/00H05K7/12H05K7/14H05K7/20909
Inventor 陈福操
Owner HENAN XINRUI ELECTRONICS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products