OTP test system and method and storage medium

A technology of testing system and testing method, which is applied in the direction of electronic circuit testing, measuring electricity, measuring devices, etc., which can solve the problems of high requirements for testers and testing tools, increasing uncertainties in the testing process, difficult control of setting temperature and wind speed, etc. problems, to achieve the effect of enhancing human-computer interaction, improving test accuracy, and eliminating uncertain factors

Inactive Publication Date: 2022-05-06
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) Using a heat gun as a heating tool for the OTP test chip, the set temperature and wind speed are not easy to control, and the temperature and wind speed directly affect the temperature rise rate;
[0005] (2) Using the data of a hand-held infrared thermometer as a test result is not accurate enough. Infrared temperature measurement is non-contact, which requires high requirements for testers and test tools, and the absolute measurement accuracy is poor;
[0006] (3) The OTP test is a process of continuously heating the IC chip. Both the heat gun and the handheld infrared thermometer require the tester to continue heating or monitoring. Uncertain factors such as shaking during the process will directly affect the test results and increase the test process. Uncertain factors, resulting in inaccurate test results

Method used

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  • OTP test system and method and storage medium
  • OTP test system and method and storage medium
  • OTP test system and method and storage medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Provide a kind of OTP test system, described test system comprises:

[0043]The chip to be tested 10, the chip to be tested 10 is embedded on the workbench, and the temperature measuring device 1 connected to the chip to be tested 10, specifically, the temperature sensing end of the temperature measuring device 1 is connected to the chip to be tested 10, and the temperature measuring device 1 One end is connected with a monitoring device 2, and the monitoring device 2 receives and monitors the first temperature data sent by the temperature measuring device 1. A heating device 3 is also included, and the heating device 3 is used for heating the chip 10 to be tested. Specifically, the heating device 3 includes a control unit and a heating cover 4 . The heating cover 4 is used to cover the chip 10 to be tested and heat the chip 10 to be tested, and obtain the second temperature data of the chip 10 to be tested by the temperature sensor in the heating cover 4, and then the ...

Embodiment 2

[0054] Corresponding to the above-mentioned embodiments, the present application provides an OTP test method, the test method comprising: detecting the first temperature data of the chip to be tested, and monitoring the first temperature data by a monitoring device;

[0055] Heating the chip to be tested to obtain second temperature data of the chip to be tested, and adjusting the heating rate of the chip to be tested according to the second temperature data received by the heating device;

[0056] When the monitoring device detects that the first temperature data exceeds the preset temperature threshold, an alarm signal is sent through the alarm.

[0057] Specifically, the specific implementation process: the temperature-sensing end of the temperature measuring device is pasted on the surface of the chip to be tested with an adhesive to detect the surface temperature of the chip to be tested, and the real-time temperature is transmitted to the monitoring device. The tester can...

Embodiment 3

[0059] A computer-readable storage medium is provided, which stores computer-executable instructions, and the computer-executable instructions are used to execute the above-mentioned OTP testing method.

[0060] In this embodiment, computer-readable storage media may include volatile and non-volatile, volatile, volatile, or Removable and non-removable media. For example, computer-readable storage media include, but are not limited to, volatile memories such as random access memory (RAM, DRAM, SRAM); and nonvolatile memories such as flash memory, various read-only memories (ROM, PROM, EPROM) , EEPROM), magnetic and ferromagnetic / ferroelectric memory (MRAM, FeRAM); and magnetic and optical storage devices (hard disks, magnetic tapes, CDs, DVDs); or other media now known or developed in the future capable of storing data for computer systems Computer readable information / data used.

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Abstract

The invention discloses an OTP testing system and method and a storage medium, and relates to the technical field of chip testing. Comprising a temperature measuring device connected with a chip to be measured, one end of the temperature measuring device is connected with a monitoring device, and the monitoring device receives and monitors first temperature data sent by the temperature measuring device; the heating device is used for heating the to-be-tested chip and comprises a control unit and a heating cover, the heating cover covers the to-be-tested chip to heat the to-be-tested chip and transmits second temperature data of the to-be-tested chip to the control unit, and the control unit adjusts the heating rate of the heating cover according to preset conditions. By improving the heating equipment, the heating device completely covers the chip, the constant temperature rise rate is ensured, the thermocouple wire temperature measurement mode is adopted, the temperature test precision is improved, the interference of external factors of non-contact temperature measurement is eliminated, a temperature monitoring and alarming device is added, the man-machine interactivity in the test process is improved, and the test efficiency is improved. And the test process is smoother.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to an OTP testing system, method and storage medium. Background technique [0002] In switching power supply chips, temperature is a very critical performance indicator. This is why high voltage and high current power switching circuits are often integrated in the chip, which will generate a lot of power consumption. With the increase of power consumption, the temperature of the chip will also change greatly. Excessive temperature rise will lead to the failure of temperature-sensitive semiconductor devices, such as components such as MOS tubes, triodes, and capacitors. When the temperature exceeds a certain value, the failure rate increases exponentially. Statistics show that for every 2°C increase in the temperature of electronic components, the reliability will drop by 10%. When the temperature rises by 50°C, the life of the components is only one-sixth of the temperature...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2894
Inventor 陈涛
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD
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