Multifunctional liquid feeding and discharging device for electroplating and working method of multifunctional liquid feeding and discharging device

Abstract

The invention discloses a multifunctional liquid feeding and discharging device for electroplating and a working method of the multifunctional liquid feeding and discharging device. Discharge waste of residual electroplating liquid in a pipeline and dilution of a stock solution by residual cleaning water are avoided. Comprising a water pump, a liquid inlet valve, a multifunctional liquid drainage combined pipe and a workpiece liquid inlet pipe which are sequentially connected and tend to rise, the water pump is used for extracting electroplating liquid from a liquid storage tank, the workpiece liquid inlet pipe is used for providing the electroplating liquid for a workpiece, and the multifunctional liquid drainage combined pipe comprises a first pipe adjacent to the workpiece liquid inlet pipe and a second pipe adjacent to the liquid inlet valve. The first pipe is inserted into a pipe hole of the second pipe, the end part of the second pipe is sealed, an overflowing gap is formed between the first pipe and the second pipe, the upper end of the second pipe is connected with a common water inlet and discharge pipe, the common water inlet and discharge pipe is communicated with the overflowing gap between the first pipe and the second pipe, and a common water inlet and discharge valve is arranged on the common water inlet and discharge pipe.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a multifunctional liquid inlet and discharge device for electroplating and a working method thereof. Background technique [0002] For the pipeline situation before improvement, see figure 1 , The main problem exists: after the electroplating is completed, the residual electroplating solution inside the pipeline will be taken away and discharged during the flushing process, resulting in the waste of electroplating chemical auxiliary materials. During the secondary electroplating, the recovered water and pure water retained in the pipeline are brought into the liquid storage tank, resulting in a decrease in the concentration of the electroplating solution. After one week of use, the concentration of the electroplating solution dropped from 220g / L to 170g / L, resulting in waste of cost and unstable product quality. Contents of the invention [0003] The purpose of the pre...

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Problems solved by technology

[0002] For the pipeline situation before improvement, see figure 1 , the main problem is that the residual plating solution inside the pipeline will be taken away and discharged during the flushing process after the electroplating is completed, resulting in the waste of electroplating chemical auxiliary materials

During the secondary electroplating, the recycled water and pure water retained in the pipeline are brought into the liquid storage tank, resulting in a drop in the concentration of the electroplating solution

After one week of use, the concentration of the electroplating solution dropped from 220g / L to 170g / L, resulting in waste of cost and unstable product quality

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