Inner core, loudspeaker module and electronic equipment

A loudspeaker module and core technology, applied in the direction of sensors, electrical components, etc., can solve the problems of insufficient driving force, unfavorable to ensure the concentricity of the voice coil frame, and the high overlap of the inner lead and the voice coil frame.

Pending Publication Date: 2022-05-13
北京荣耀终端有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the inner lead is crossed by the surface of the voice coil bobbin, it will cause a high overlap between the inner lead and the voice coil bobbin
In this way, on the one hand, the thickness of the speaker module cannot be reduced; on the other hand, in the thinner speaker module, the height of the magnetic circuit system is compressed, resulting in insufficient driving force, which cannot meet the audio performance of the speaker module.
If an avoidance gap is set on the voice coil bobbin to make the inner lead lead out of the voice coil through the avoidance gap, since the height of the voice coil bobbin is small, the avoidance gap will often break the voice coil bobbin, making the voice coil bobbin unable to maintain It is a structural part, which is not conducive to ensuring the coaxiality of the voice coil skeleton, diaphragm group, and voice coil

Method used

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  • Inner core, loudspeaker module and electronic equipment
  • Inner core, loudspeaker module and electronic equipment
  • Inner core, loudspeaker module and electronic equipment

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Embodiment Construction

[0078] In this embodiment of the application, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only, and should not be understood as indicating or implying relative importance or implicitly indicating the indicated The number of technical characteristics. Thus, a feature defined as "first", "second", "third" and "fourth" may expressly or implicitly include one or more of such features.

[0079]In the embodiments of the present application, the term "comprising", "comprising" or any other variant thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements, but also includes Including other elements not expressly listed, or also including elements inherent in such process, method, article or apparatus. Without further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical ...

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Abstract

The invention provides a core, a loudspeaker module and electronic equipment, relates to the technical field of electronic equipment, and can realize thinning of the electronic equipment and ensure the audio performance of the loudspeaker module and the coaxiality of a voice coil skeleton, a diaphragm group and a voice coil. The inner core of the loudspeaker module comprises a voice coil framework and a voice coil, and the voice coil framework comprises a main body part and a supporting part. The main body part is annular, and the supporting part is arranged on the outer edge of the main body part. The part of the main body part where the supporting part is located is provided with a first gap, and the first gap does not break the part of the voice coil skeleton composed of the supporting part and the part of the main body part. The voice coil is fixed on one axial side of the main body part; an inner side lead of the voice coil comprises a spanning section; the spanning section extends from the inner edge of the surface, close to the main body part, of the voice coil to the outer edge of the surface, and the spanning section is accommodated in the first gap. The kernel provided by the embodiment of the invention is used for converting an audio electric signal into sound.

Description

[0001] This application claims the priority of the Chinese patent application with the application number 202110838012.1 and the title of the invention "a core, speaker module and electronic equipment" submitted to the State Intellectual Property Office on July 23, 2021, the entire contents of which are incorporated by reference in this application. technical field [0002] The present application relates to the technical field of electronic equipment, in particular to a core, a loudspeaker module and electronic equipment. Background technique [0003] Currently, electronic devices such as personal computers (PCs), tablets, and mobile phones need to be designed to be thinner and thinner due to consumer demand. In order to realize the thinner and lighter design of electronic equipment, it is necessary to design thinner speaker modules and cores. In the core of the speaker module, the voice coil skeleton is placed between the voice coil and the diaphragm group, and is used to...

Claims

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Application Information

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IPC IPC(8): H04R9/06H04R9/04H04R9/02
CPCH04R9/06H04R9/045H04R9/025
Inventor 刘金华刘卫褚建飞周俊
Owner 北京荣耀终端有限公司
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