Graphene-like heat dissipation structure for heat dissipation of frequency conversion mainboard

Abstract

The invention discloses a graphene-like heat dissipation structure for heat dissipation of a frequency conversion mainboard. The graphene-like heat dissipation structure comprises a bottom plate, a middle plate and an upper plate, the upper surface of the bottom plate is connected with the lower surface of the middle plate through a concave-convex surface; a plurality of transverse and longitudinal through grooves are formed in the middle plate, graphene-like heat conduction strips are inserted into the transverse through grooves, and graphene-like heat conduction plates are inserted into the longitudinal through grooves; the lower end of the graphene-like heat conduction strip is of a circular structure, and the upper end of the graphene-like heat conduction strip is of a boss-shaped structure; the graphene-like heat-conducting plate is inserted into the boss-shaped structures of the graphene-like heat-conducting strips in a penetrating manner; the lower surface of the bottom plate is coated with a graphene-like heat conduction layer. According to the device, a form of an external framework is adopted, a graphene-like material with excellent heat-conducting property is used as a built-in heat-conducting part, and heat is quickly conducted outwards in an internal conduction manner, so that the temperature protection on the frequency conversion mainboard can be effectively improved, and the frequency conversion mainboard is prevented from working in a high-temperature state for a long time.

Description

technical field [0001] The invention relates to a graphene like heat dissipation structure for heat dissipation of a frequency conversion main board. Background technology [0002] With the improvement of living standards, the demand for frequency conversion appliances presents an increasing demand, in which the heat dissipation requirements of frequency conversion devices are much higher than those of existing fixed frequency components. [0003] Among them, the heat dissipation for the main board is the key point of the overall frequency conversion main part heat dissipation system, and the service life of the frequency conversion main part basically depends on the heat dissipation capacity. [0004] The existing heat dissipation components are often based on copper alloy, heat pipe and other components to transfer heat to the outside world, so as to effectively control the temperature of the main board. [0005] However, with the development of miniaturization and integration ...

AI Technical Summary

Problems solved by technology

[0005] However, with the development of miniaturization and integration of parts, the heat dissipation capacity of existing large and medium-sized heat dissipation components has been difficult to meet the needs of existing products, and with the development of heat-conducting materials such as graphene, graphene-like, and artificial graphite films Development, the use of graphene's efficient thermal conductivity and lightweight material characteristics can well solve the heat dissipation needs of existing frequency conversion components

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