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Cooling device, cooling assembly, and liquid cooling system

A technology of cooling device and assembly, which is applied in the field of cooling device and liquid cooling, and can solve problems such as O-ring deterioration

Pending Publication Date: 2022-05-17
QUANTA COMPUTER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, O-rings are generally made of elastomeric materials, so O-rings also degrade over time, especially due to high liquid coolant pressure in the system

Method used

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  • Cooling device, cooling assembly, and liquid cooling system
  • Cooling device, cooling assembly, and liquid cooling system
  • Cooling device, cooling assembly, and liquid cooling system

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Embodiment Construction

[0094] The various embodiments are described with reference to the drawings, wherein like reference characters are used to designate similar or equivalent elements throughout. The drawings are not drawn to scale and are provided solely to illustrate the invention. It should be understood that numerous specific details, relationships, and methods are set forth in order to provide a comprehensive understanding. However, it will be readily apparent to one of ordinary skill in the art that the various embodiments may be practiced without one or more of the specific details or otherwise. In other instances, well-known structures or operations are shown in detail to avoid obscuring certain features of various embodiments. The various embodiments are not limited by the order of acts or events shown, as some acts may occur in different orders and / or concurrently with other acts or events. Furthermore, not all illustrated acts or events may be required to implement a methodology in a...

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PUM

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Abstract

The invention discloses a cooling device, a cooling assembly, and a liquid cooling system for a computing system. The cooling device comprises a body, a socket and a connector. The body includes a panel and an internal conduit. A connector extends from the panel. A connector is removably coupled to the receptacle, the connector including an outer end and an inner end. The connector also includes a nut having an outer surface that mates with a corresponding inner surface of the receptacle, and a tubular input. The connector also has a sleeve having an inner bore and an outer surface abutting the tubular input of the nut. An inner conduit is coupled to the inner end of the connector to circulate cooling liquid through the body. The nut includes a sloped portion and the sleeve includes an abducted portion to assist in securing the nut and sleeve in the internal conduit.

Description

technical field [0001] The invention relates to a cooling computing system component and method, in particular to a cooling device, a cooling assembly, a liquid cooling system and a liquid cooling method. The method uses a cooling plate to cool components of a server system. Background technique [0002] Computer enclosures, as well as other types of electronic equipment, often contain many electronic components that generate heat. Generally, heat in such systems is limited by the enclosure, and additional components or methods are required to reduce the temperature of the system. The heat generated by each component increases based on the processing power. Therefore, overheating is a common problem that can negatively affect the performance of components in the system. Excessive heat reduces efficiency and may cause long-term damage to components. [0003] One common way to reduce the temperature in a computing system is to include one or more fans in the system to incre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20218H05K7/20509F28F3/12F28F9/10F28D2021/0029F16L19/028H05K7/20772H05K7/20272H05K7/20327H05K7/20254H01R13/11F16L19/0206
Inventor 陈朝荣黄玉年林永庆
Owner QUANTA COMPUTER INC