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Heat dissipation assembly and electronic equipment

A technology of heat dissipation components and heat dissipation parts, applied in the direction of electrical digital data processing, digital data processing components, instruments, etc., can solve the problems of unstable heat dissipation performance of heat sources, difficulty in determining the distance between heat sources and shielding covers, etc., and achieve effective shielding and heat conduction good performance effect

Pending Publication Date: 2022-05-27
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present application provides a heat dissipation component and electronic equipment, which are used to solve the problem that the distance between the heat source and the shield is difficult to determine, which makes the heat dissipation performance of the heat source unstable

Method used

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  • Heat dissipation assembly and electronic equipment
  • Heat dissipation assembly and electronic equipment
  • Heat dissipation assembly and electronic equipment

Examples

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Embodiment Construction

[0024] The present application will be further described in detail below with reference to the accompanying drawings and embodiments. It is particularly pointed out that the following examples are only used to illustrate the present application, but do not limit the scope of the present application. Similarly, the following embodiments are only some of the embodiments of the present application, but not all of the embodiments, and all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0025] Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor a separate or alternative embodiment that is mutual...

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Abstract

The invention relates to a heat dissipation assembly and electronic equipment. The heat dissipation assembly is fixed to a first mainboard, and the first mainboard comprises a fixing plate and a heat source fixed to the fixing plate. The heat dissipation assembly comprises a cover body and a heat conduction piece, the cover body is arranged on the fixing plate in a covering mode, a shielding space is defined by the cover body and the fixing plate, and the heat source is located in the shielding space; the heat conduction piece can be close to or away from the heat source in the preset direction so that the heat conduction piece can make full contact with the heat source. The electronic equipment comprises the heat dissipation assembly. In this way, the distance between the heat conduction piece and the heat source can be adjusted, and the heat conduction performance between the heat source and the heat conduction piece is good. In addition, the heat source is accommodated in the shielding space, so that the heat source can be effectively shielded.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, and in particular, to heat dissipation components and electronic equipment. Background technique [0002] Smart host is a new product derived from the combination of customer front-end equipment (CPE, Customer Premise Equipment) and computer host. The RF signals and network signals generated by the PCE's mainboard will interfere with the mainboard of the computer host, so the mainboard of the computer host needs to be shielded, but the mainboard chip of the computer host needs to be dissipated. At present, the heat dissipation of the motherboard chip is mainly achieved by sandwiching a thermal pad between the chip and the shield. However, due to the influence of processing errors, the distance between the chip and the shield is difficult to determine, which makes the heat dissipation performance of the motherboard chip unstable. SUMMARY OF THE INVENTION [0003] The pres...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/203G06F1/206
Inventor 张明豪
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD