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Probe device for realizing low-damage detection of chip and detection method

A detection method and low-damage technology, which can be used in measuring devices, parts of electrical measuring instruments, and measuring electricity, etc., which can solve the problems of difficult contact between the probe and the positive and negative electrodes of the chip, chip damage, etc., so as to reduce the damage of the device. damage, damage reduction effects

Pending Publication Date: 2022-06-07
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the minimum size of the chip can reach several microns, it is not easy to realize the contact between the probe and the positive and negative electrodes of the chip, and when the probe is in contact with the chip, if the strength of the probe is not well grasped, it is very easy to cause damage to the chip. damage

Method used

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  • Probe device for realizing low-damage detection of chip and detection method
  • Probe device for realizing low-damage detection of chip and detection method
  • Probe device for realizing low-damage detection of chip and detection method

Examples

Experimental program
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Effect test

Embodiment 1

[0036] A probe device for realizing low-damage chip detection, including a probe, a sensing module, a detection module and a prompt module;

[0037] The sensing module is used to sense the deformation, and the sensing module includes a fixed part, a movable part and a deformation sensing unit, and the probe drives the movable part to move upwards, and the deformation sensing unit is deformed;

[0038] The detection module measures the deformation of the feeling module, detects and sends out a signal to control the prompt module;

[0039] The prompt module prompts according to the signal sent by the detection module.

[0040] In the sensing module, the fixed part is an upper base plate, the movable part is a lower base plate, and the deformation / pressure sensing unit is located between the upper base plate and the lower base plate.

[0041] The sensing unit is a deformation unit.

[0042] The detection module includes a laser range finder.

[0043] The prompt module is a pro...

Embodiment 2

[0055] A probe device for realizing low-damage chip detection, including a probe, a sensing module, a detection module and a prompt module;

[0056] The sensing module is used for sensing pressure, and the sensing module includes a fixed part, a movable part and a pressure sensing unit, the probe drives the movable part to move upwards, and the pressure sensing unit undergoes a pressure change;

[0057] The detection module measures the pressure change that occurs in the feeling module, detects and sends out a signal to control the prompt module;

[0058] The prompt module prompts according to the signal sent by the detection module.

[0059] Specifically, in the sensing module, the fixed part is an upper base plate, the movable part is a lower base plate, and the deformation / pressure sensing unit is located between the upper base plate and the lower base plate.

[0060] Specifically, the pressure sensing unit is a spring.

[0061] Specifically, the detection module includes a...

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PUM

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Abstract

The invention provides a probe device for realizing low-damage detection of a chip, which comprises a probe, a sensing module, a detection module and a prompting module, the sensing module is used for sensing deformation / pressure and comprises a fixed part, a movable part and a deformation / pressure sensing unit, the probe drives the movable part to move upwards, and the deformation / pressure sensing unit generates deformation / pressure change; the detection module is used for measuring the deformation / pressure change of the sensing module, detecting and sending a signal to control the prompt module; the probe device provided by the invention can reduce the damage to the chip when the probe is in contact with the chip.

Description

technical field [0001] The invention relates to the field of chip detection, in particular to a probe device and a detection method for realizing low-damage detection of chips. Background technique [0002] With people's pursuit of ultra-high-definition display technology, the development of small-size chips represented by Mini LED / Micro LED has been promoted. In terms of chip technology, the chip preparation process of Mini LED / Micro LED is not much different from the traditional large-size chip process. In the detection stage, at present, most of the power-on detection of MiniLED / microLED chips continues the practice of traditional LEDs. By manually adjusting the probe to contact the positive and negative electrodes of the chip to conduct conduction, the performance indicators such as photoelectric color of the device can be checked. Make a note. However, since the minimum size of the chip can reach several microns, it is not easy to realize the contact between the probe...

Claims

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Application Information

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IPC IPC(8): G01R31/28G01R1/067
CPCG01R31/2851G01R1/06711G01R1/06788
Inventor 陈忠刘时彪吴挺竹卢霆威赖寿强吕毅军陈国龙朱丽虹
Owner XIAMEN UNIV