Texture removing method for mobile phone backboard

Abstract

The invention discloses a mobile phone backboard texture removing method which comprises the following steps: packaging a to-be-processed mobile phone backboard into a packaging frame, curing epoxy resin on the surface of the to-be-processed mobile phone backboard, then carrying out grinding operation on the surface on which the epoxy resin is packaged and cured, and finally carrying out polishing operation to complete texture removing operation on the surface of the mobile phone backboard. The method has the advantages that the surface of the mobile phone backboard is not directly polished, and the surface of the mobile phone backboard to be treated is polished after being subjected to epoxy resin curing packaging, so that the situation that the mobile phone backboard is excessively abraded when being polished due to the fact that the amount of feed is too large during polishing can be effectively avoided; the thickness and the structural strength of the processed mobile phone backboard are influenced.

Description

technical field [0001] The invention relates to the field of mobile phone backplane processing, in particular to a method for removing textures from mobile phone backplanes. Background technique [0002] The backlight is a light source device used to ensure that the back of the liquid crystal display emits light. The backlight of the mobile phone is the backplane of the mobile phone. It is a necessary accessory in the manufacture of mobile phones and a carrier for installing the display. The metal sheet, the plastic frame of the mobile phone backlight and the metal back plate are made by integrating the rubber and iron. After the raw material of the back plate is stamped and formed by the stamping production line, the flatness of the back plate will inevitably be affected. Therefore, it is necessary to introduce a leveling process. The leveling process is generally processed by drawing and grinding. Stamping, drawing and grinding are all performed. It will leave a metal pro...

AI Technical Summary

Problems solved by technology

After the raw material of the backplane is punched and formed by the stamping production line, the flatness of the backplane will inevitably be affected. Therefore, a leveling process needs to be introduced. The leveling process is generally processed by drawing and grinding. Metal processing textures will be left on the surface of the mobile phone backplane. The metal processing textures are uneven in the microscopic state, which will seriously affect the bonding of millions of thin film transistors on it, and have a negative impact on the overall optical performance. impact, so it is necessary to detexture the back panel of the mobile phone