Integrated additive manufacturing monolithic integration method of electronic device

Abstract

The invention discloses an integrated additive manufacturing monolithic integration method of an electronic device, an integrated electronic device is integrally manufactured by using a multi-nozzle three-dimensional printer capable of loading multiple functional materials at the same time, and printing materials at least include but not limited to insulating materials, conductive materials and selectively removable supporting materials. In a printing process, a mechanical structure of the device is manufactured by using an insulating material, an electrode and a lead interconnection part of the device are manufactured by using a conductive material, a temporary supporting structure of a three-dimensional structure is manufactured by using a selectively removable sacrificial material, and the supporting structure is selectively removed after integral manufacturing is completed to obtain a complete device. Meanwhile, corresponding vertical wire structures located on the same horizontal plane are printed to lead electrodes of all electronic devices to a bonding pad formed at the bottom, so that the printed integrated electronic devices are attached to a circuit board in an inverted patch mode, and metal is selectively grown on the surface of the structure with the low resistivity requirement in the monolithic integrated device.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a monolithic integration method for integrated additive manufacturing of electronic devices. Background technique [0002] The manufacturing process of traditional microelectronic sensors usually needs to go through the manufacturing processes of deposition, photolithography, etching and metallization. Not only the production cycle is long, but also the product models are small and the transportation cost is high. It is difficult to meet the growing demand of users for personalized customization. need. There are usually two methods for multi-sensor monolithic integration based on microelectronics technology: first, to manufacture various sensors separately and then assemble them on the prefabricated adapter board; The way of paving is processed in one flow. The first integration method requires a special assembly process and an interposer board, which increases the complexi...

AI Technical Summary

Problems solved by technology

The first integration method requires a special assembly process and adapter board, which increases the complexity of the process

The second integration method not only needs to comprehensively consider the interaction between the front and rear processes of different devices, but also needs to consider the step coverage ability of photoresist on different devices, and the structure and types of devices that can be integrated are greatly limited.

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