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Wafer manufacturing apparatus

A wafer manufacturing and wafer technology, which is applied to auxiliary devices, manufacturing tools, measuring devices, etc., can solve the problems of reduced wafer quality and insufficient planarization.

Pending Publication Date: 2022-06-24
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, there is a problem that even if the upper surface of the semiconductor ingot is flattened by a grinding member, the upper surface of the semiconductor ingot is not sufficiently flattened. The converging point of the laser beam of the layer is positioned at an appropriate position inside the semiconductor ingot, which will degrade the quality of the wafer to be peeled off from the semiconductor ingot

Method used

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  • Wafer manufacturing apparatus
  • Wafer manufacturing apparatus
  • Wafer manufacturing apparatus

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Embodiment Construction

[0039]Hereinafter, a wafer manufacturing apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0040] figure 1 The illustrated wafer manufacturing apparatus 2 includes at least: an ingot grinding unit 4; a laser irradiation unit 6; a wafer peeling unit 8; A wafer support part for supporting the wafers; and a conveyor unit 10 that transfers the ingot supported by the tray 9 between the ingot grinding unit 4, the laser irradiation unit 6, and the wafer peeling unit 8, and is arranged adjacent to the conveyor unit 10. There is a quality inspection unit 13 . In addition, the wafer manufacturing apparatus 2 of the present embodiment further includes an ingot stocker 11 that houses ingots supported by the tray 9 , and an ingot delivery unit 12 that houses ingots supported by the tray 9 in the ingot stocker 11 . It is handed over to the conveyor belt unit 10 .

[0041] refer to figure 2 The ingot ...

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Abstract

The invention provides a wafer manufacturing device which can prevent the quality of a wafer from being reduced. The wafer manufacturing apparatus includes: an ingot grinding unit configured to grind and flatten an upper surface of an ingot; a laser irradiation unit that forms a peeling layer at a depth from the upper surface of the ingot corresponding to the thickness of the wafer to be manufactured; a wafer peeling unit which holds the upper surface of the ingot and peels the wafer from the peeling layer; a tray having an ingot support portion and a wafer support portion; and a conveyor unit that conveys the ingot supported by the tray among the ingot grinding unit, the laser irradiation unit, and the wafer peeling unit.

Description

technical field [0001] The present invention relates to a wafer manufacturing apparatus for manufacturing wafers from semiconductor ingots. Background technique [0002] IC, LSI, LED and other devices are based on Si (silicon) or Al 2 O 3 (Sapphire) etc. are formed by laminating a functional layer on the front surface of a wafer as a raw material and dividing by a plurality of intersecting planned dividing lines. In addition, power devices, LEDs, and the like are formed by laminating a functional layer on the front surface of a wafer made of single crystal SiC (silicon carbide) and dividing it by a plurality of intersecting planned division lines. The wafer on which the devices are formed is processed by a cutting device or a laser processing device on the lines to be divided to be divided into individual device chips, and each of the divided device chips is used in electronic equipment such as mobile phones and personal computers. [0003] A wafer forming a device is gen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B19/22B24B41/00B24B41/04B24B41/06B24B47/12B24B47/22B24B49/12B23K26/36B23K26/70
CPCB24B19/22B24B41/005B24B41/04B24B41/06B24B47/12B24B47/22B24B49/12B23K26/36B23K26/702H01L21/67219H01L21/67173H01L21/67706H01L21/67736B23K26/53B23K26/0622B23K26/0823B23K26/083B23K26/0006B23K2101/40B23K2101/36B23K2103/56B23K26/032B24B7/228B24B7/005B24B7/04B24B27/0069B23K26/16B23K37/04B28D5/04H01L21/67092G01N21/9501H01L2221/68386B23K26/037H04N23/57
Inventor 山本凉兵平田和也
Owner DISCO CORP