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Internet of Things device packaging equipment

A technology for packaging equipment and the Internet of Things, applied in the protection of internal/peripheral computer components, etc., can solve the problems of lack of packaging limit, noise, and inability to adapt to different sizes of IoT devices, so as to avoid equipment damage, avoid noise pollution, Improve the effect of sound insulation

Pending Publication Date: 2022-06-28
天津捷赢科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, there are many types of packaging equipment on the market and rich functions, but there are also the following shortcomings: 1. The device cannot adapt to different sizes of IoT devices. 2. The device does not limit the packaging. 3. Noise will be generated during the packaging process. To this end, we propose an IoT device packaging device

Method used

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  • Internet of Things device packaging equipment
  • Internet of Things device packaging equipment

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Embodiment Construction

[0018] In order to make the technical means, creative features, achievement goals and effects realized by the present invention easy to understand, the present invention will be further described below with reference to the specific embodiments.

[0019] like Figure 1-2 As shown, an IoT device packaging device includes a bottom plate 1, a bracket 3 is mounted on the top of the bottom plate 1 through bolts, and sound insulation boards 4 are installed on both sides of the bracket 3 by opening slots, and the top of the bracket 3 is installed A hydraulic push rod 9 is installed by bolts, a top plate 7 is installed at the driving end of the hydraulic push rod 9 by bolts, a sealing machine 8 is installed at the bottom of the top plate 7 by bolts, and both sides of the top of the bottom plate 1 are located inside the bracket 3 through the The limit rod 6 is installed with bolts, and the bottom of the limit rod 6 is equipped with a spring 5 through screws. The top of the bottom plate...

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Abstract

The Internet of Things device packaging equipment comprises a bottom plate, a support is installed at the top of the bottom plate through bolts, sound insulation plates are installed on the two sides in the support through grooves, a hydraulic push rod is installed at the top in the support through bolts, and a top plate is installed at the driving end of the hydraulic push rod through bolts. The packaging machine is mounted at the bottom of the top plate through bolts, limiting rods are mounted on the two sides of the top of the bottom plate and located on the inner sides of the supports through bolts, springs are mounted at the bottoms of the peripheries of the limiting rods through screws, a workbench is mounted on the top of the bottom plate and located on the inner sides of the limiting rods through bolts, and a sliding groove is formed in the surface of the top of the workbench. Limiting frames are arranged on the two sides of the top of the workbench, rubber cushions are installed on the inner sides of the limiting frames through screws, and a screw rod is installed on one side in the workbench through a bearing. The Internet of Things device packaging equipment is reasonable in structure, convenient to use and suitable for being widely popularized and used.

Description

technical field [0001] The present invention relates to the technical field of Internet of Things devices, in particular to a packaging device for Internet of Things devices. Background technique [0002] Packaging is the process of assembling an integrated circuit into a chip final product. Simply put, it is to put the integrated circuit bare chip produced by the foundry on a substrate that acts as a carrier, lead out the pins, and then fix the packaging into a As a whole, packaging mainly focuses on the form and category of the package, the material of the substrate and shell, and the lead, emphasizing its important role in protecting the chip, enhancing the electrical and thermal performance, and facilitating the assembly of the whole machine. [0003] At present, there are many kinds of packaging equipment on the market with rich functions, but they also have the following shortcomings: 1. The device cannot adapt to IoT devices of different sizes. 2. The device does not ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F21/87
CPCG06F21/87
Inventor 贺丽珍庞宝琴
Owner 天津捷赢科技有限公司