Filling method for circuit board filling resin
A technology of filling resin and filling method, which is applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of reducing product yield, pollution, process influence, etc., and achieve the effect of improving yield rate
Pending Publication Date: 2022-07-15
广东依顿电子科技股份有限公司
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AI Technical Summary
Problems solved by technology
[0002] At present, some holes and grooves on the circuit board need to be filled with resin, and the resin oil will inevitably overflow during the resin filling process. Once the overflowed resin oil enters other holes and grooves that do not need to be filled with resin The structure will cause pollution to these holes and groove structures, which will have a great impact on subsequent processes and greatly reduce the yield of products
Method used
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Embodiment Construction
[0030] The features of the present invention and other related features are described in further detail below through the examples, so as to facilitate the understanding of those skilled in the industry:
[0031] like Figure 1 to Figure 6 As shown, a filling method for circuit board filling resin, the circuit board 1 is concavely provided with a first concave position 3 that needs to be filled with resin 2, is adjacent to the first concave position 3 and does not need to be filled with resin 2. For the second recess 4 filled with resin 2, the filling method includes the following steps:
[0032] Step 1: Cover the surface of the circuit board 1 with a dry film 5, the thickness of the dry film 5 is A, and 5μm
[0033] Step 2: curing the dry film 5 at and around the second recess 4 by exposure;
[0034] Step 3: remove the uncured dry film 5 in step 2 by developing;
[0035] Step 4: Fill the first recess 3 with resin 2;
[0036] Step 5: Polish the surface of the circu...
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Abstract
The invention discloses a method for filling a circuit board with resin, the circuit board is concavely provided with a first concave position needing to be filled with resin and a second concave position which is adjacent to the first concave position and does not need to be filled with resin, the filling method comprises the following steps: step 1, the surface of the circuit board is covered with a dry film, the thickness of the dry film is A, and A is larger than 5 microns and smaller than or equal to 25 microns; 2, the dry film at the second concave position and on the periphery of the second concave position is cured through exposure; 3, removing the dry film which is not cured in the step 2 through development; fourthly, the first concave position is filled with resin; 5, polishing the resin overflowing out of the first concave position on the surface of the circuit board to keep the circuit board flat; and step 6, carrying out film stripping treatment on the cured dry film in the step 2 so as to expose the second concave position again.
Description
technical field [0001] The invention relates to a filling method for filling resin for circuit boards. Background technique [0002] At present, some holes and grooves on the circuit board need to be filled with resin. In the process of filling resin, resin oil will inevitably overflow. Once these overflowing resin oil enters other holes and grooves that do not need to be filled with resin The structure will cause pollution to these holes and groove structures, which will have a great impact on subsequent processes and greatly reduce the yield of products. [0003] Therefore, how to overcome the above-mentioned defects has become an important issue to be solved urgently by those skilled in the art. SUMMARY OF THE INVENTION [0004] The present invention overcomes the deficiencies of the above-mentioned technologies, and provides a filling method for filling resin for circuit boards. [0005] To achieve the above object, the present invention has adopted the following tec...
Claims
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Login to View More IPC IPC(8): H05K3/00H05K3/40
CPCH05K3/0094H05K3/40H05K2201/0959
Inventor 陈远文陈佳术
Owner 广东依顿电子科技股份有限公司