Heat dissipation substrate and preparation equipment thereof
A technology for heat-dissipating substrates and substrates, applied in synthetic resin layered products, chemical instruments and methods, layered products, etc., can solve the problems of easy dislocation of metal core substrates and thermally conductive insulating layer materials, affecting the use of heat-dissipating substrates, etc.
Pending Publication Date: 2022-07-22
江苏汉瑞通信科技有限公司
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Problems solved by technology
[0005] The purpose of the present invention is to provide a heat dissipation substrate and its preparation equipment, which solves the problem that the heat dissipation substrate is easily misaligned between the metal core substrate and the heat conduction insulating layer material after the heat dissipation substrate has been used for a long time, which affects the use of the heat dissipation substrate
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[0033]For this specific embodiment, the first mounting plate 110 and the second mounting plate 111 are rotatably connected and are both located above the mounting seat 105 , and the two pushing assemblies are respectively disposed on the first mounting plate 110 and below the second mounting plate 111 , the first punching cylinder 106 is arranged above the first mounting plate 110 , and the first punching template 108 is fixed to the output end of the first punching cylinder 106 connection, the bottom of the first punching template 108 is provided with a plurality of punching notches 112 at intervals, the second punching cylinder 107 is arranged above the second mounting plate 111, and the second punching template 109 and the The output end of the second punching cylinder 107 is fixedly connected, the bottom of the second punching die plate 109 is provided with a plurality of punching bumps 113 at intervals, and the output end of the first punching cylinder 106 is provided with...
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The invention relates to the technical field of heat dissipation substrate preparation, in particular to a heat dissipation substrate and preparation equipment thereof.The heat dissipation substrate comprises a metal core substrate and a heat conduction insulating layer, the metal core substrate is bonded with the heat conduction insulating layer, the heat conduction insulating layer is provided with a plurality of protruding blocks at intervals, and the metal core substrate is provided with a plurality of notches corresponding to the protruding blocks; the heat conduction insulating layer is formed by mixing epoxy resin and heat conduction filler, and due to the fact that the protruding blocks are located in the notches, the phenomenon that the heat conduction insulating layer and the metal core substrate are misplaced after being used for a long time is avoided. Therefore, the problem that after the heat dissipation substrate is used for a long time, the metal core substrate and the heat conduction insulating layer material are prone to dislocation, and use of the heat dissipation substrate is affected is solved.
Description
technical field [0001] The invention relates to the technical field of preparation of heat dissipation substrates, in particular to a heat dissipation substrate and its preparation equipment. Background technique [0002] Most of the heat-dissipating substrates are used for the installation of electronic parts, and most of the heat-dissipating substrates have poor heat dissipation. [0003] At present, there is a heat-dissipating substrate, and a heat-conducting insulating layer material is provided on the metal core substrate to enhance the heat-dissipating performance of the heat-dissipating substrate. [0004] However, most of the above-mentioned metal core substrate and thermally conductive insulating layer materials are directly bonded together. After the heat dissipation substrate is used for a long time, the metal core substrate and the thermally conductive insulating layer material are easily dislocated, which affects the use of the heat dissipation substrate. SUMM...
Claims
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IPC IPC(8): B32B3/30B32B7/12B32B15/00B32B15/092B32B27/38B32B27/20B32B37/12B32B38/00
CPCB32B3/30B32B7/12B32B15/00B32B15/092B32B27/38B32B27/20B32B37/12B32B38/0012B32B2307/206B32B2307/302
Inventor 金琦翟海峰
Owner 江苏汉瑞通信科技有限公司