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LED support, manufacturing method thereof and LED device

A technology for LED brackets and LED devices, which is applied in semiconductor devices, electrical components, circuits, etc., and can solve problems affecting the bonding of LED chips and lead frames, and easy overflow of plastic materials

Pending Publication Date: 2022-07-29
SHENZHEN JUFEI OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the deficiencies of the above-mentioned related technologies, the purpose of this application is to provide an LED bracket and its manufacturing method, and an LED device, aiming at solving the problem that the plastic material easily overflows into the functional area of ​​the lead frame during the injection molding stage of the prior art to affect the LED. Die to lead frame bonding

Method used

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  • LED support, manufacturing method thereof and LED device
  • LED support, manufacturing method thereof and LED device
  • LED support, manufacturing method thereof and LED device

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Embodiment Construction

[0034] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the related drawings. The preferred embodiments of the present application are shown in the accompanying drawings. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that a thorough and complete understanding of the disclosure of this application is provided.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the present application are for the purpose of describing particular embodiments only, and are not intended to limit the present application.

[0036] With the wider application of LED devices, the mar...

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Abstract

The invention provides an LED support, a manufacturing method thereof and an LED device. The LED support comprises a metal frame, a metal baffle, an insulating part and an insulating support. The metal frame comprises a first frame and a second frame; the first frame and the second frame are separated through a through groove. A first packaging groove penetrating through the top surface and the bottom surface of the metal baffle plate is formed in the metal baffle plate, and the first packaging groove is communicated with the through groove; the bottom face of the metal baffle makes contact with the front face of the metal frame and is opposite to the top face of the metal baffle. A groove is formed in the top surface of the metal baffle plate; the insulating part fills the through groove of the metal frame; the insulating bracket wraps the outer side wall of the metal baffle plate and forms a second packaging groove with at least part of the top surface of the metal baffle plate; at least part of the top surface of the metal baffle plate is a step surface between the first packaging groove and the second packaging groove, and the groove of the metal baffle plate is communicated with the second packaging groove; the plastic material is effectively prevented from overflowing to the functional area on the metal frame, and the reliability of bonding the LED chip and the LED bracket is ensured.

Description

technical field [0001] The invention relates to the technical field of light emitting diodes, and in particular, to an LED bracket, a manufacturing method thereof, and an LED device. Background technique [0002] With the wider application of LED devices, the market requirements for LED devices are also getting higher and higher. In the existing LED device, the LED chip is fixed in the packaging slot of the LED bracket. The LED bracket at least includes a lead frame and a plastic bracket. The plastic bracket is arranged on the lead frame and forms a packaging slot with the lead frame for accommodating the LED. chip. When the plastic bracket is made by injection molding on the lead frame, the plastic material is likely to overflow to the bottom of the package groove to affect the bonding of the LED chip and the LED bracket. [0003] Therefore, how to provide an LED device with higher reliability is an urgent problem to be solved. SUMMARY OF THE INVENTION [0004] In view...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/54H01L33/62
CPCH01L33/486H01L33/54H01L33/62H01L2933/0033
Inventor 谭攀峰邢美正杨丽敏谭青青
Owner SHENZHEN JUFEI OPTOELECTRONICS
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