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Multi-step high-frequency PCB (Printed Circuit Board) and lamination preparation process thereof

A PCB board and high-frequency technology, which is applied in the field of multi-level high-frequency PCB board and its lamination process, can solve the problems of high cost of components, reduction of the volume of components on the PCB, and the inability to reduce the volume of components, etc., to achieve The effect of increasing the number of loads, saving volume, and reducing production costs

Pending Publication Date: 2022-08-05
CHENGYI ELECTRONICS JIAXING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, the commonly used solution is to reduce the volume of components on the PCB. Due to the limitations of the size of some components and the high cost of small components, the application of this solution in practice has been greatly challenged. Limits the development of many electronic products

Method used

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  • Multi-step high-frequency PCB (Printed Circuit Board) and lamination preparation process thereof
  • Multi-step high-frequency PCB (Printed Circuit Board) and lamination preparation process thereof
  • Multi-step high-frequency PCB (Printed Circuit Board) and lamination preparation process thereof

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Embodiment Construction

[0024] refer to Figure 1 to Figure 6 The embodiments of the present invention will be further described.

[0025] In the description of the present invention, it should be noted that for orientation words, such as the terms "center", "horizontal (X)", "longitudinal (Y)", "vertical (Z)", "length", " Width, Thickness, Top, Bottom, Front, Back, Left, Right, Vertical, Horizontal, Top, Bottom, Inside ", "outside", "clockwise", "counterclockwise" and other indications of orientation and positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying The device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and should not be construed as limiting the specific protection scope of the present invention.

[0026] In addition, the terms "first" and ...

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Abstract

The invention discloses a multi-step high-frequency PCB which comprises a main body formed by at least two high-frequency Core boards, all the high-frequency Core boards are sequentially stacked from top to bottom, a high-frequency PP sheet is arranged between every two adjacent high-frequency Core boards, and a plurality of step windows are formed in the main body from top to bottom. The bottom of each stepped window extends to the upper surface of one of the high-frequency Core boards, the upper surface of the high-frequency Core board corresponding to the bottom of the stepped window is provided with a component bonding pad and a wiring design, and the component bonding pad is located at the stepped window. And meanwhile, the manufacturing cost of the PCB and the electronic equipment can be reduced.

Description

technical field [0001] The invention belongs to the technical field of PCB boards, and more particularly relates to a multi-level stepped high-frequency PCB board and a lamination preparation process thereof. Background technique [0002] The volume of electronic products is gradually miniaturized and lightened, but the functions are becoming more and more complex, which means that each PCB board needs to be continuously reduced in size and needs to have the ability to carry more components. The currently commonly used solution is to reduce the size of the components on the PCB. Due to the constraints of the inability to reduce the volume of some components and the high cost of small-volume components, the application of this solution in practice is greatly challenged, and then Limit the development of many electronic products. SUMMARY OF THE INVENTION [0003] In view of the deficiencies of the prior art, the present invention provides a high-frequency PCB board composed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/18H05K3/46H05K3/00H05K3/34
CPCH05K1/0237H05K1/183H05K3/4611H05K3/0044H05K3/34
Inventor 张本贤李志雄舒志迁魏和平陈蓁邱锡曼
Owner CHENGYI ELECTRONICS JIAXING
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