Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Precise workstable structure for array IC photoetching system

A technology of integrated circuits and photolithography systems, applied in the field of precision workbench structures, can solve problems such as difficult synchronization of workbenches

Inactive Publication Date: 2004-09-29
TSINGHUA UNIV
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Large strokes and high operating speeds, as well as the synchronization of two worktables with different strokes and speeds are difficult to achieve

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Precise workstable structure for array IC photoetching system
  • Precise workstable structure for array IC photoetching system
  • Precise workstable structure for array IC photoetching system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] please see Figure 1 to Figure 9 . 1 is an anti-vibration table, and the 2nd is a workbench base, which links to each other with the anti-vibration table 1 with a spring 213. The 14th, ball screw, it is connected with workbench base 2 screws through support members 151,152. 131,132 are support rails connected with workbench base 2 screws. The Y-direction aerostatic guide rail 3 is connected with the support guide rails 131 and 132 . The Y-direction piezoelectric ceramic frame 4 is fixed on the Y-direction aerostatic guide rail 3 with screws. One end is fixed on its inner bottom surface to the Y-direction piezoelectric ceramic body 111 of T-shaped Y-direction motion workbench 5 in Y direction, and 161 is its electrode; To the inductance micrometer, the Y-direction motion table 5 is connected with the Y-direction piezoelectric ceramic frame 4 with a spring. The T-shaped Y-shaped motion table 5 is in contact with the T-shaped guide rail air cushions 123, 124 on the Y-...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The present invention belongs to the integrated circuit manufacturing superfine engineering. The precise work table includes micro turntable, turntable seat coaxially connected to the turntable, turntable driving support, small X direction table with X and Y direction mirror and capable of reciprocating in X direction, hydrostatic X direction air guide, Y direction stable, hydrostatic Y direction air guide, Y direction micro mechanism, rolling screw bolt to drive the hydrostatic Y direction air guide and elastic shock-proof worktable. The micro mechanism for the turntable driving support and the Y direction stable are driven with piezoelectrics; and both the X direction table and the Y direction stable are T-shaped. The present invention can ensure both scanning precision and photoetching efficiency.

Description

technical field [0001] The invention discloses a precision workbench structure in an array type integrated circuit photoetching system, which belongs to the technical field of micro engineering in integrated circuit manufacturing. Background technique [0002] In the existing integrated circuit lithography system, the workbench is divided into a workpiece stage for clamping a silicon wafer and a wafer stage for clamping a mask. Both tables must have high-speed movement in the X and Y directions, and the stroke is relatively large. The X and Y strokes of the workpiece table for clamping silicon wafers are determined according to the size of the silicon wafers to be processed. When processing a 10-inch wafer, the stroke is 300mm×300mm, and the stroke of the wafer holder for the mask is determined according to the size of the silicon wafers. It depends on the reduction ratio of the mask projection. When the reduction ratio of processing a 10-inch wafer is 4:1, the stroke is 10...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
Inventor 徐端颐范晓冬齐国生钱坤蒋培军麦雪松
Owner TSINGHUA UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com