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Method for mounting subpanel on electronic parts

A technology for electronic parts and mounting plates, which is applied in the field of mounting the mounting plate on the body of electronic parts, can solve the problems of dislocation, inability to configure a support tool for cutting, and increase in the cost of stamping metal molds.

Inactive Publication Date: 2005-07-13
TEIKOKU TSUSHIN IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] ①In the case of installing a slider as a single piece to a sliding type, etc., by a separately prepared slider mounting device, since the single-piece slider is a relatively light small piece composed of a thin plate, The position where it is attached to the sliding type is slightly shifted, and there is a problem that the strength of the slider fixed to the sliding type is reduced.
However, in the case where the slider does not protrude from the sliding member installation surface of the sliding member, etc., in the state where the sliding member is mounted on the slider, since the connecting portion must be located on the slider installation surface of the sliding member, etc above, it is not possible to configure the cutting support tool for cutting the joint from the top and bottom
[0007] ③In addition, as a method of cutting the connecting part of the slider formed on the strip-shaped thin plate, there is a structure of a press die composed of a cutting support tool and a cutting moving tool, but when the pitch of each slider is narrow, There is a problem that the cost of these stamping metal molds increases
[0008] ④The existing sliding parts are installed on the sliding parts, etc., as mentioned above, the small protrusions provided on the sliding parts, etc. are inserted into the small holes provided on the sliding parts, and the front ends of the small protrusions are thermally riveted to carry out; but because there must be a hot riveting process, it also hinders the improvement of assembly efficiency

Method used

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  • Method for mounting subpanel on electronic parts
  • Method for mounting subpanel on electronic parts
  • Method for mounting subpanel on electronic parts

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Experimental program
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Embodiment Construction

[0023] Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0024] figure 1 It is a perspective view showing an installation method of a mounting plate (hereinafter referred to as a "slider" in this embodiment) 20 to an electronic component body (hereinafter referred to as a "rotational member" in this embodiment) 50 according to an embodiment of the present invention. As shown in the figure, in the present invention, a thin plate 10 and a rotary shape 50 are prepared.

[0025] It can be seen in this figure that the thin plate 10 is made of a band-shaped metal plate, and the sliding members 20, 20, . Further, a feeding hole 11 is provided on the side of the thin plate 10 .

[0026] Here, the slider 20 is substantially disc-shaped, has a substantially rectangular insertion hole 21 in its center, and has connecting holes 23 penetrating through it at three places around it, and protrudes downwards on its outer pe...

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PUM

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Abstract

A method for installing a mounting plate on an electronic component, which can improve the assembly accuracy and efficiency and reduce the cost of manufacturing equipment. The feature of the invention is that it has the following steps: the thin plate (10) is continuously formed on the thin plate (10) by pressing sequentially 10) The process of attaching the slider (mounting plate) (20) connected by the connection part (41, 41) to the slider (20) connected to the thin plate (10), respectively installing the rotating type (electronic component) The operation of (50), cut off the connecting part (41, 41) of the sliding part (20) of the rotating type (50) on the rotating type (50) to take out the rotating type of installing the sliding part (20) in a single piece The operation of piece (50).

Description

technical field [0001] The invention relates to a method and a structure for installing a mounting board on an electronic component body. Background technique [0002] Now, for example, a member made of a thin metal plate mounted on a synthetic resin sliding member or a rotary knob can be freely rotated or freely slidably arranged on a base plate provided with a sliding template. By making the aforementioned sliding member Or the electronic parts (variable resistors or switches) that change the output by turning or sliding the slider to the sliding template to change its output are widely used. [0003] As a prior art, in order to effectively install the slider on the sliding type, etc., firstly, the strip-shaped thin plate is sequentially press-worked while drawing out the strip-shaped thin plate to continuously form the slider connected by the connecting portion on the aforementioned thin plate, Then use a stamping metal die consisting of a supporting tool for cutting and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C10/14H01C10/00H01C10/32H05K13/00
Inventor 高桥重正细川充八木信行森田幸三
Owner TEIKOKU TSUSHIN IND CO LTD