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Method and device for detecting semiconductor circuit

A semiconductor and circuit technology, applied in the field of semiconductor circuit detection and detection devices, can solve problems such as circuit failure, current flow, and detection device complexity

Inactive Publication Date: 2006-02-15
YAMAHA MOTOR ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, the detection device described above would be complex and expensive
Also, such a power supply and load equipment would be expensive if the same load voltage and current were applied to each workpiece as in actual use
[0006] In addition, if one of the devices exhibits only a small electrostatic breakdown, it will allow current to flow, which will be detected by traditional detection methods.
In the case of such electrostatic breakdown, the above-mentioned device initially works, but as it is used, it will aggravate the destruction of the faulty device, making the entire circuit inoperable and reducing the life of the circuit

Method used

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  • Method and device for detecting semiconductor circuit
  • Method and device for detecting semiconductor circuit
  • Method and device for detecting semiconductor circuit

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Embodiment Construction

[0024] The drawings will now be described in detail, first referring to figure 1 , which is a block diagram of a semiconductor circuit testing apparatus, generally indicated by reference numeral 21, constructed and operative in accordance with one embodiment of the present invention. The printed circuit board, called workpiece, will be referred to as a special case later in conjunction with the attached Figure 5-13 is described and generally indicated by the reference numeral 22 . The workpiece 21 is placed in a suitable type of inspection device body (not shown).

[0025] The power source 23 is connected to the workpiece 22 through a load circuit 24 . The load circuit 24 is a circuit that carries a load equal to or smaller than that carried in actual use, and is applied to the workpiece 22 to detect the quality or characteristics of the workpiece 22 .

[0026] The power supply 23 is connected with the control device 25 . The control device 25 controls the on / off of the w...

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Abstract

The present invention is a method and apparatus employing image processing of photographic data by a thermographic camera to determine the heat development of individual semiconductor devices. Therefore, defects of individual devices such as disconnection due to breaks and abnormal heat development due to electrostatic breakdowns can be determined reliably.

Description

technical field [0001] The invention relates to a method for testing a semiconductor circuit including a plurality of semiconductor devices and a testing device thereof. Background technique [0002] In the process of manufacturing various semiconductor devices composed of a plurality of circuit boards on which a plurality of semiconductor devices are mounted, after the semiconductor devices are assembled on the circuit board, before they are transported or transferred to the next process, The performance of the semiconductor circuit board (workpiece) is first detected. In the performance testing operation, generally speaking, the quality of the workpiece (whether there is a defect) is checked by applying an operating current to the semiconductor device, and it is tested whether each semiconductor device works. [0003] The aforementioned testing methods and apparatus cannot provide a complete test of every semiconductor device in the entire circuit in all cases. For examp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28
Inventor 荒木千博
Owner YAMAHA MOTOR ELECTRONICS CO LTD