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Packaging material and its package light-mixed type light-emitting diode device

A technology of light-emitting diodes and packaging materials, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., and can solve the problems of uneven light emission of white light-emitting diode bulbs, reduction of luminous efficiency of white light-emitting diode bulbs, and light shielding advanced questions

Inactive Publication Date: 2006-07-26
EPISTAR CORP
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AI Technical Summary

Problems solved by technology

[0004] A shortcoming of this prior art white light-emitting diode bulb is: the size of the phosphor particles mixed in its packaging material is micron order (Micronorder), such as several microns to hundreds of microns. There is unavoidable precipitation of the agent particles in the packaging material, resulting in uneven light emission of the white light-emitting diode bulb, and even blocking the light emitted by the light-emitting diode chip, resulting in the undesirable result of reducing the luminous efficiency of the white light-emitting diode bulb
[0005] Another shortcoming of this prior art white light-emitting diode bulb is: its phosphor particles are opaque, so only the surface material has the effect of accepting the excitation of blue light to produce yellow light, and the internal material has only the adverse effect of shielding light, so The effective utilization rate of fluorescent agent material is relatively low, and the adverse effect of shading light is relatively high

Method used

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  • Packaging material and its package light-mixed type light-emitting diode device
  • Packaging material and its package light-mixed type light-emitting diode device

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Embodiment Construction

[0020] First of all, it needs to be explained that the principle of the present invention is: in a basic material such as epoxy resin, many nanomaterial units that can be excited to produce yellow light when excited by blue light are mixed in, and the blue light is encapsulated with the obtained packaging material. The blue light produced by it is mixed with the yellow light produced by the excitation of these nanomaterial units that can be excited to produce white light.

[0021] According to a preferred embodiment of the present invention, the encapsulation material contains many nanomaterial units that can be excited to emit light, such as fluorescent agent nanoparticles. Between 5 and 30 nanometers. These phosphor nanoparticles are mixed into a liquid epoxy resin base material (after the liquid base material is made, it can also be solid) to obtain a substantially uniform distribution filled with many phosphor nanoparticles. When mixing the epoxy resin mixture packaging m...

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Abstract

The invention discloses a packaging material and light-mixed LED packaged by it. It contains; a basic material and many fluorescent agent's nano particles scattered in the basic material. The LED contains; a blue LED; and a packaging material, which includes a basic material and many fluorescent agent's nano particles scattered in the basic material, wherein the blue LED is packaged in the packaging material.

Description

technical field [0001] The invention relates to a packaging material used for packaging semiconductor chips (chips), in particular to a light-mixing light-emitting diode device formed by packaging a light-emitting diode chip with the packaging material. Background technique [0002] Light emitting diodes are widely used, for example, in optical display devices, traffic signs, data storage devices, communication devices, lighting devices, and medical devices. Among the light-emitting diodes, white light-emitting diodes have the greatest potential demand and are the most important. If the production cost of white light-emitting diodes can be reduced and their service life can be extended, it is possible to replace the white fluorescent tubes or light bulbs currently used in large quantities. [0003] At present, there is a white light-emitting diode bulb on the market, which is made by encapsulating a blue light-emitting diode with a packaging material mixed with fluorescent a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L23/29
CPCH01L2224/48091H01L2224/48247H01L2224/48257H01L2224/49107
Inventor 李秉杰
Owner EPISTAR CORP
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