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Circuit board for mounting electronic parts

A technology of circuit components and substrates, which is applied in the direction of circuit substrate materials, printed circuit components, circuits, etc., and can solve problems such as cracks in the permanent protective layer

Inactive Publication Date: 2006-08-02
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because it is easy to concentrate stress on these right angles, such as Figure 10 As shown, there is a new problem that cracks 64 are prone to occur on the permanent protective layer 63 near the right angle

Method used

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  • Circuit board for mounting electronic parts
  • Circuit board for mounting electronic parts
  • Circuit board for mounting electronic parts

Examples

Experimental program
Comparison scheme
Effect test

no. 2 Embodiment

[0119] image 3 It is a schematic diagram in which almost a quarter of the wiring board 51 for mounting electronic components is disconnected. The wiring board 51 has a glass epoxy substrate 54 as a core material. Also, instead of the glass epoxy substrate 54, a polyimide substrate or a bismaleimide triazine BT (bismaleimide triazine) resin substrate may also be used. Adhesive layers 55 (insulating layers) are formed on both surfaces of the substrate 54 using an additive-specific adhesive. The surface of the adhesive layer 55 is roughened so as to have a plurality of recesses for fixing. Here, as the binder, a photosensitive resin resistant to acid or oxidizing agent and cured heat-resistant resin particles soluble in acid or oxidizing agent are used. Because of this structure, the adhesive is suitable for forming fine images with high precision. The detailed composition of the adhesive is the same as in the above-mentioned examples.

[0120] A permanent solder resist lay...

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PUM

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Abstract

A circuit board for mounting electronic parts includes first connecting terminal groups composed of connecting terminals densely formed on the front surface of a base substrate having through holes and second connecting terminal groups composed of connecting terminals formed in at least outer peripheral section on the rear surface of the substrate. The first groups are connected to the second group through the holes. On the substrate front surface, build-up multilayered wiring layers having via holes are formed and the first groups are connected to the second group through the wiring layers and through holes.

Description

technical field [0001] The present invention relates to a printed circuit board for mounting circuit components in which connection terminal groups are formed on both front and back surfaces. Background technique [0002] Conventionally, a wiring board 21 for mounting electronic components as shown in FIG. 8 is known as a printed circuit board on which a bare chip such as a flip chip or a package such as a BGA (Bump Grid Array) is mounted. [0003] Such a wiring board 21 has a base plate 22 having conductor layers formed mainly by a subtractive method (subtractive method) on both the front and back sides of the base plate 22 . In the central portion of the surface of the bottom plate 22, a region for mounting components is provided. In the same area, a plurality of pads 23 constituting the first pad group are densely formed. Each pad 23 corresponds to a bump BP located at the bottom of the die C1. [0004] On the other hand, a plurality of spacers 24 constituting a second...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/12H05K1/03H05K3/46
Inventor 浅井元雄川村洋一郎森要二
Owner IBIDEN CO LTD